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Category:Kazuya HIRATA: Difference between revisions - WikiPatents Jump to content

Category:Kazuya HIRATA: Difference between revisions

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=== Executive Summary ===
=== Executive Summary ===
Kazuya HIRATA is an inventor who has filed 7 patents. Their primary areas of innovation include Mechanical treatment, e.g. grinding, polishing, cutting {( (6 patents), {Apparatus for mechanical treatment  (or grinding or cutting, see the relevant groups in subclasses (6 patents), {Edge treatment, chamfering} (3 patents), and they have worked with companies such as DISCO CORPORATION (7 patents). Their most frequent collaborators include [[Category:Hayato IGA|Hayato IGA]] (7 collaborations), [[Category:Kentaro IIZUKA|Kentaro IIZUKA]] (1 collaborations), [[Category:Hironobu OZAWA|Hironobu OZAWA]] (1 collaborations).
Kazuya HIRATA is an inventor who has filed 3 patents. Their primary areas of innovation include SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal (2 patents), Working by laser beam, e.g. welding, cutting or boring (2 patents), SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal (2 patents), and they have worked with companies such as DISCO CORPORATION (3 patents). Their most frequent collaborators include [[Category:Asahi NOMOTO|Asahi NOMOTO]] (1 collaborations), [[Category:Nobuki KAKIUCHI|Nobuki KAKIUCHI]] (1 collaborations), [[Category:Tomoki YOSHINO|Tomoki YOSHINO]] (1 collaborations).


=== Patent Filing Activity ===
=== Patent Filing Activity ===
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==== List of Technology Areas ====
==== List of Technology Areas ====
* [[:Category:CPC_H01L21/304|H01L21/304]] (Mechanical treatment, e.g. grinding, polishing, cutting {(): 6 patents
* [[:Category:CPC_H01L21/67092|H01L21/67092]] ({Apparatus for mechanical treatment  (or grinding or cutting, see the relevant groups in subclasses): 6 patents
* [[:Category:CPC_H01L21/02021|H01L21/02021]] ({Edge treatment, chamfering}): 3 patents
* [[:Category:CPC_H01L21/268|H01L21/268]] (Bombardment with radiation {(): 2 patents
* [[:Category:CPC_B23K26/53|B23K26/53]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 2 patents
* [[:Category:CPC_B23K26/53|B23K26/53]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 2 patents
* [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 1 patents
* [[:Category:CPC_B23K26/0093|B23K26/0093]] (Working by laser beam, e.g. welding, cutting or boring): 2 patents
* [[:Category:CPC_H01L2221/68327|H01L2221/68327]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_B23K2101/40|B23K2101/40]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
* [[:Category:CPC_H01L21/67253|H01L21/67253]] (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
* [[:Category:CPC_B23K26/066|B23K26/066]] (by using masks): 1 patents
* [[:Category:CPC_H01L22/20|H01L22/20]] ({Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps}): 1 patents
* [[:Category:CPC_B23K26/0622|B23K26/0622]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 1 patents
* [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/544|H01L23/544]] (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps  (test patterns for characterising or monitoring manufacturing processes): 1 patents
* [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_B23K26/364|B23K26/364]] (Removing material  (): 1 patents
* [[:Category:CPC_H01L24/94|H01L24/94]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H10B80/00|H10B80/00]] (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
* [[:Category:CPC_H01L2224/32145|H01L2224/32145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/83|H01L2224/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_B32B38/0004|B32B38/0004]] (Ancillary operations in connection with laminating processes): 1 patents
* [[:Category:CPC_B32B38/0012|B32B38/0012]] (Ancillary operations in connection with laminating processes): 1 patents
* [[:Category:CPC_B32B41/00|B32B41/00]] (Arrangements for controlling or monitoring lamination processes; Safety arrangements): 1 patents
* [[:Category:CPC_H01L22/12|H01L22/12]] ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions  (electrical measurement of diffusions): 1 patents
* [[:Category:CPC_H01L22/12|H01L22/12]] ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions  (electrical measurement of diffusions): 1 patents
* [[:Category:CPC_B32B2038/0016|B32B2038/0016]] (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
* [[:Category:CPC_H01L2223/54493|H01L2223/54493]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_B32B2310/0843|B32B2310/0843]] (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
* [[:Category:CPC_B28D5/047|B28D5/047]] (WORKING STONE OR STONE-LIKE MATERIALS): 1 patents
* [[:Category:CPC_B23K26/364|B23K26/364]] (Removing material  (): 1 patents
* [[:Category:CPC_B28D5/0082|B28D5/0082]] (Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor  (working by grinding or polishing): 1 patents
* [[:Category:CPC_H01L21/67155|H01L21/67155]] ({Apparatus for applying a liquid, a resin, an ink or the like  (): 1 patents
* [[:Category:CPC_H01L21/67242|H01L21/67242]] ({Apparatus for monitoring, sorting or marking  (testing or measuring during manufacture): 1 patents
* [[:Category:CPC_H01L21/02016|H01L21/02016]] ({Backside treatment}): 1 patents
* [[:Category:CPC_H01L21/68764|H01L21/68764]] (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents


=== Companies ===
=== Companies ===
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==== List of Companies ====
==== List of Companies ====
* DISCO CORPORATION: 7 patents
* DISCO CORPORATION: 3 patents


=== Collaborators ===
=== Collaborators ===
* [[:Category:Hayato IGA|Hayato IGA]][[Category:Hayato IGA]] (7 collaborations)
* [[:Category:Asahi NOMOTO|Asahi NOMOTO]][[Category:Asahi NOMOTO]] (1 collaborations)
* [[:Category:Kentaro IIZUKA|Kentaro IIZUKA]][[Category:Kentaro IIZUKA]] (1 collaborations)
* [[:Category:Nobuki KAKIUCHI|Nobuki KAKIUCHI]][[Category:Nobuki KAKIUCHI]] (1 collaborations)
* [[:Category:Hironobu OZAWA|Hironobu OZAWA]][[Category:Hironobu OZAWA]] (1 collaborations)
* [[:Category:Tomoki YOSHINO|Tomoki YOSHINO]][[Category:Tomoki YOSHINO]] (1 collaborations)
* [[:Category:Mato HATTORI|Mato HATTORI]][[Category:Mato HATTORI]] (1 collaborations)
* [[:Category:Hideo IWATA|Hideo IWATA]][[Category:Hideo IWATA]] (1 collaborations)
* [[:Category:Kazuma SEKIYA|Kazuma SEKIYA]][[Category:Kazuma SEKIYA]] (1 collaborations)


[[Category:Kazuya HIRATA]]
[[Category:Kazuya HIRATA]]
[[Category:Inventors]]
[[Category:Inventors]]
[[Category:Inventors filing patents with DISCO CORPORATION]]
[[Category:Inventors filing patents with DISCO CORPORATION]]

Latest revision as of 03:46, 8 April 2025

Kazuya HIRATA

Executive Summary

Kazuya HIRATA is an inventor who has filed 3 patents. Their primary areas of innovation include SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal (2 patents), Working by laser beam, e.g. welding, cutting or boring (2 patents), SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal (2 patents), and they have worked with companies such as DISCO CORPORATION (3 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

  • B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
  • B23K26/0093 (Working by laser beam, e.g. welding, cutting or boring): 2 patents
  • B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
  • B23K26/066 (by using masks): 1 patents
  • B23K26/0622 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
  • H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
  • B23K26/364 (Removing material (): 1 patents
  • H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions): 1 patents
  • H01L2223/54493 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • B28D5/047 (WORKING STONE OR STONE-LIKE MATERIALS): 1 patents
  • B28D5/0082 (Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor (working by grinding or polishing): 1 patents

Companies

List of Companies

  • DISCO CORPORATION: 3 patents

Collaborators

Subcategories

This category has the following 4 subcategories, out of 4 total.

A

H

K

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