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Plasma Technology Patent Application Trends 2025: Difference between revisions

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== Plasma Technology Patent Application Filing Activity ==
== Plasma Technology Patent Application Filing Activity ==
== Plasma Technology patent applications in 2025 ==
== Plasma Technology patent applications in 2025 ==
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_February 2025.png|border|800px]]
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_March 2025.png|border|800px]]


== Top Technology Areas in Plasma Technology ==
== Top Technology Areas in Plasma Technology ==
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_February 2025.png|border|800px]]
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_March 2025.png|border|800px]]


=== Top CPC Codes ===
=== Top CPC Codes ===
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available)
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available)
** Count: 17 patents
** Count: 28 patents
** Example: [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]]
** Example: [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]]
* [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available)
* [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available)
** Count: 13 patents
** Count: 19 patents
** Example: [[20250069851. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]]
** Example: [[20250069851. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available)
** Count: 17 patents
** Example: [[20250069858. PLASMA PROCESSING APPARATUS AND CONTROL METHOD THEREFOR (ULVAC, INC.)]]
* [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available)
** Count: 15 patents
** Example: [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]]
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available)
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available)
** Count: 11 patents
** Count: 14 patents
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available)
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available)
** Count: 11 patents
** Count: 14 patents
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available)
* [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available)
** Count: 10 patents
** Count: 10 patents
** Example: [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]]
** Example: [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available)
* [[:Category:CPC_H01L21/31116|H01L21/31116]] (No explanation available)
** Count: 10 patents
** Count: 10 patents
** Example: [[20250069858. PLASMA PROCESSING APPARATUS AND CONTROL METHOD THEREFOR (ULVAC, INC.)]]
** Example: [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01L21/3065|H01L21/3065]] (No explanation available)
* [[:Category:CPC_H01L21/3065|H01L21/3065]] (No explanation available)
** Count: 10 patents
** Count: 10 patents
** Example: [[20250006537. Plasma Etching Method and Apparatus (SPTS Technologies Limited)]]
** Example: [[20250006537. Plasma Etching Method and Apparatus (SPTS Technologies Limited)]]
* [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available)
* [[:Category:CPC_H01J37/32724|H01J37/32724]] (No explanation available)
** Count: 7 patents
** Count: 8 patents
** Example: [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250069860. PLASMA PROCESSING METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)]]
* [[:Category:CPC_H01L21/31116|H01L21/31116]] (No explanation available)
** Count: 7 patents
** Example: [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available)
** Count: 7 patents
** Example: [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]


== Top Companies in Plasma Technology 2025 ==
== Top Companies in Plasma Technology 2025 ==
Line 42: Line 42:


=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
* Number of Plasma Technology patents: 28
* Number of Plasma Technology patents: 42
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 8 patents
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 9 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available): 8 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 9 patents
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 7 patents
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 9 patents
* Recent patents:
* Recent patents:
** [[20250014866. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250109)
** [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
** [[20250014872. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
** [[20250014874. ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
* Number of Plasma Technology patents: 12
* Top CPC codes:
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 5 patents
** [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available): 4 patents
** [[:Category:CPC_H01J37/32935|H01J37/32935]] (No explanation available): 3 patents
* Recent patents:
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
** [[20250112029. SUPPRESSING HEATING OF A PLASMA PROCESSING CHAMBER LID (Applied Materials, Inc.)]] (20250403)
** [[20250112076. GROUND ELECTRODE FORMED IN AN ELECTROSTATIC CHUCK FOR A PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20250403)
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
* Number of Plasma Technology patents: 7
* Number of Plasma Technology patents: 7
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 5 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/327|H01J2237/327]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available): 2 patents
* Recent patents:
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250087497. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250313)
** [[20250022697. PLASMA SYSTEM HAVING RESIDENCE TIME TUNING ASSEMBLY (Applied Materials, Inc.)]] (20250116)
** [[20250104981. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
** [[20250062131. PLASMA ETCHING IN SEMICONDUCTOR PROCESSING (Applied Materials, Inc.)]] (20250220)
** [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
* Number of Plasma Technology patents: 4
* Number of Plasma Technology patents: 4
Line 71: Line 81:
** [[20250079177. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250306)
** [[20250079177. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250306)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
* Number of Plasma Technology patents: 3
* Top CPC codes:
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32834|H01J37/32834]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 1 patents
* Recent patents:
** [[20250069867. PLASMA PROCESSING APPARATUS AND GAS EXHAUST METHOD (Hitachi High-Tech Corporation)]] (20250227)
** [[20250046580. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250206)
** [[20250046582. REGENERATING METHOD FOR INNER MEMBER OF PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250206)
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
* Number of Plasma Technology patents: 3
* Number of Plasma Technology patents: 4
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J2237/3341|H01J2237/3341]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32697|H01J37/32697]] (No explanation available): 2 patents
** [[:Category:CPC_H01L21/31116|H01L21/31116]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/332|H01J2237/332]] (No explanation available): 2 patents
* Recent patents:
* Recent patents:
** [[20250046620. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250206)
** [[20250079136. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250306)
** [[20250079136. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250306)
** [[20250095981. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250320)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
=== [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]] ===
=== [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]] ===
Line 118: Line 118:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
=== [[:Category:Research & Business Foundation SUNGKYUNKWAN UNIVERSITY|Research & Business Foundation SUNGKYUNKWAN UNIVERSITY]] ===
=== [[:Category:Lam Research Corporation|Lam Research Corporation]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_A61K9/1271|A61K9/1271]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32091|H01J37/32091]] (No explanation available): 2 patents
** [[:Category:CPC_B01J19/087|B01J19/087]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32422|H01J37/32422]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available): 1 patents
* Recent patents:
* Recent patents:
** [[20250009661. PLASMA COATING METHOD OF NANOVESICLE SURFACE AND PLASMA JET DEVICE FOR PLASMA COATING OF NANOVESICLE SURFACE (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]] (20250109)
** [[20250087458. TUNING VOLTAGE SETPOINT IN A PULSED RF SIGNAL FOR A TUNABLE EDGE SHEATH SYSTEM (Lam Research Corporation)]] (20250313)
** [[20250014868. ETCHING PLASMA PROCESSING APPARATUS INCLUDING CONSUMABLE METAL MEMBER (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]] (20250109)
** [[20250054730. Systems and Methods for Extracting Process Control Information from Radiofrequency Supply System of Plasma Processing System (Lam Research Corporation)]] (20250213)
=== [[:Category:Impinj, Inc.|Impinj, Inc.]] ===
=== [[:Category:Beijing E-Town Semiconductor Technology Co., Ltd.|Beijing E-Town Semiconductor Technology Co., Ltd.]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 2
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01L24/05|H01L24/05]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32651|H01J37/32651]] (No explanation available): 1 patents
** [[:Category:CPC_G06K19/07722|G06K19/07722]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 1 patents
** [[:Category:CPC_H01L24/03|H01L24/03]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32596|H01J37/32596]] (No explanation available): 1 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250112030. PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20250403)
** [[20250014935. ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20250109)


== New Companies in Plasma Technology (Last Month) ==
== New Companies in Plasma Technology (Last Month) ==
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[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]


* [[:Category:CPC_H01L29/7851|H01L29/7851]] (No explanation available)
* [[:Category:CPC_H01L21/32051|H01L21/32051]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
** Example: [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01L29/66795|H01L29/66795]] (No explanation available)
* [[:Category:CPC_H01J37/3288|H01J37/3288]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
** Example: [[20250104981. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01J37/32981|H01J37/32981]] (No explanation available)
* [[:Category:CPC_H01L21/6831|H01L21/6831]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]]
** Example: [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]]
* [[:Category:CPC_C23C28/042|C23C28/042]] (No explanation available)
* [[:Category:CPC_H01L21/67259|H01L21/67259]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]]
* [[:Category:CPC_C23C14/46|C23C14/46]] (No explanation available)
* [[:Category:CPC_C23C16/50|C23C16/50]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
* [[:Category:CPC_C23C14/30|C23C14/30]] (No explanation available)
* [[:Category:CPC_C23C16/45565|C23C16/45565]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
* [[:Category:CPC_C23C14/26|C23C14/26]] (No explanation available)
* [[:Category:CPC_H05H2245/30|H05H2245/30]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/0694|C23C14/0694]] (No explanation available)
* [[:Category:CPC_H05H1/26|H05H1/26]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/083|C23C14/083]] (No explanation available)
* [[:Category:CPC_A61P35/00|A61P35/00]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_B01J19/087|B01J19/087]] (No explanation available)
* [[:Category:CPC_A61K47/6913|A61K47/6913]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250009661. PLASMA COATING METHOD OF NANOVESICLE SURFACE AND PLASMA JET DEVICE FOR PLASMA COATING OF NANOVESICLE SURFACE (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]


== Top Companies in Emerging Plasma Technology Technologies 2025==
== Top Companies in Emerging Plasma Technology Technologies 2025==
[[File:Top_Companies_in_Emerging_Plasma_Technology_Technologies.png|border|800px]]
[[File:Top_Companies_in_Emerging_Plasma_Technology_Technologies.png|border|800px]]


* [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 6 patents
* [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
* [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 2 patents
* [[:Category:Wisconsin Alumni Research Foundation|Wisconsin Alumni Research Foundation]]: 4 patents
* [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 1 patents
* [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* [[:Category:Research & Business Foundation SUNGKYUNKWAN UNIVERSITY|Research & Business Foundation SUNGKYUNKWAN UNIVERSITY]]: 1 patents


== Top Inventors in Plasma Technology ==
== Top Inventors in Plasma Technology ==
[[File:Top_50_Inventors_in_Plasma_Technology.png|border|800px]]
[[File:Top_50_Inventors_in_Plasma_Technology.png|border|800px]]


=== [[:Category:Taro IKEDA|Taro IKEDA]] ===
* Number of Plasma Technology patents: 5
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
* Recent patents:
** [[20250104974. Plasma Processing Device (Tokyo Electron Limited)]] (20250327)
** [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
* Number of Plasma Technology patents: 4
* Number of Plasma Technology patents: 4
Line 202: Line 210:
** [[20250062101. CONTROL METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250220)
** [[20250062101. CONTROL METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250220)
** [[20250014872. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250014872. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 3 patents
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Takashi ARAMAKI|Takashi ARAMAKI]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
** [[20250112031. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND CLEANING METHOD (Tokyo Electron Limited)]] (20250403)
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Lifu LI|Lifu LI]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
** [[20250112031. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND CLEANING METHOD (Tokyo Electron Limited)]] (20250403)
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Kenichi KUWAHARA|Kenichi KUWAHARA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
** [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]]: 1 patents
* Recent patents:
** [[20250095963. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250320)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
** [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
=== [[:Category:Eiki KAMATA|Eiki KAMATA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250095973. Plasma Processing Apparatus and Method for Measuring Resonance Frequency (Tokyo Electron Limited)]] (20250320)
** [[20250104972. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250014863. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250014864. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104971. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Merritt Funk|Merritt Funk of Austin TX (US)]] ===
=== [[:Category:Merritt Funk|Merritt Funk of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 245: Line 302:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] ===
=== [[:Category:Kazushi KANEKO|Kazushi KANEKO]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20250102)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250095973. Plasma Processing Apparatus and Method for Measuring Resonance Frequency (Tokyo Electron Limited)]] (20250320)
=== [[:Category:Takahiro SHINDO|Takahiro SHINDO]] ===
=== [[:Category:Takahiro SHINDO|Takahiro SHINDO]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 259: Line 316:
** [[20250006471. NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250006471. NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250046575. Plasma Processing Device (Tokyo Electron Limited)]] (20250206)
** [[20250046575. Plasma Processing Device (Tokyo Electron Limited)]] (20250206)
=== [[:Category:Yue GUO|Yue GUO of Redwood City CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Yang YANG|Yang YANG of San Diego CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:A N M Wasekul AZAD|A N M Wasekul AZAD of Santa Clara CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Nicolas J. BRIGHT|Nicolas J. BRIGHT of Arlington WA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Shogo OKITA|Shogo OKITA]] ===
=== [[:Category:Shogo OKITA|Shogo OKITA]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 361: Line 446:
** [[20250079128. PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS (Tokyo Electron Limited)]] (20250306)
** [[20250079128. PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS (Tokyo Electron Limited)]] (20250306)
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Maolin Long|Maolin Long of Santa Clara CA (US)]] ===
=== [[:Category:Satoshi UNE|Satoshi UNE]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Mattson Technology, Inc.|Mattson Technology, Inc.]]: 1 patents
** [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]]: 2 patents
** [[:Category:Beijing E-Town Semiconductor Technology Co., Ltd.|Beijing E-Town Semiconductor Technology Co., Ltd.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250062103. Cooled Shield for ICP Source (Mattson Technology, Inc.)]] (20250220)
** [[20250079136. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250306)
** [[20250014935. ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20250109)
** [[20250095981. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250320)
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
=== [[:Category:Nobutaka SASAKI|Nobutaka SASAKI]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250014863. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
** [[20250014864. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Tuqiang NI|Tuqiang NI]] ===
=== [[:Category:Toshiki AKAMA|Toshiki AKAMA]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Zhihao WANG|Zhihao WANG]] ===
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
* Number of Plasma Technology patents: 1
=== [[:Category:Shusei KATO|Shusei KATO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Kailin WANG|Kailin WANG]] ===
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
* Number of Plasma Technology patents: 1
=== [[:Category:Gyeong min PARK|Gyeong min PARK]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
=== [[:Category:David Coumou|David Coumou of Webster NY (US)]] ===
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
* Number of Plasma Technology patents: 1
=== [[:Category:Maolin Long|Maolin Long of Santa Clara CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Mattson Technology, Inc.|Mattson Technology, Inc.]]: 1 patents
** [[:Category:Beijing E-Town Semiconductor Technology Co., Ltd.|Beijing E-Town Semiconductor Technology Co., Ltd.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250062103. Cooled Shield for ICP Source (Mattson Technology, Inc.)]] (20250220)
=== [[:Category:Zhi Wang|Zhi Wang of Sunnyvale CA (US)]] ===
** [[20250014935. ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20250109)
* Number of Plasma Technology patents: 1
=== [[:Category:Sho KUMAKURA|Sho KUMAKURA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Tao Zhang|Tao Zhang of San Ramon CA (US)]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Soichiro KIMURA|Soichiro KIMURA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:David Peterson|David Peterson of San Jose CA (US)]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Koyumi SASA|Koyumi SASA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Mina T. FARAG|Mina T. FARAG of Cupertino CA (US)]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Nobuhiro ODASHIMA|Nobuhiro ODASHIMA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]] (20250130)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Terry BLUCK|Terry BLUCK of Santa Clara CA (US)]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Yuji MASAKI|Yuji MASAKI]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]] (20250130)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:James GUZZO|James GUZZO]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Noboru TAKEMOTO|Noboru TAKEMOTO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Harley K. HEINRICH|Harley K. HEINRICH of Seattle WA (US)]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Makoto KOBAYASHI|Makoto KOBAYASHI]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Christopher J. DIORIO|Christopher J. DIORIO of Shoreline WA (US)]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Alexei Marakhtanov|Alexei Marakhtanov of Albany CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
** [[:Category:Lam Research Corporation|Lam Research Corporation]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250087458. TUNING VOLTAGE SETPOINT IN A PULSED RF SIGNAL FOR A TUNABLE EDGE SHEATH SYSTEM (Lam Research Corporation)]] (20250313)
=== [[:Category:Janne Lehtinen|Janne Lehtinen]] ===
** [[20250054730. Systems and Methods for Extracting Process Control Information from Radiofrequency Supply System of Plasma Processing System (Lam Research Corporation)]] (20250213)
* Number of Plasma Technology patents: 1
=== [[:Category:Toshifumi KITAHARA|Toshifumi KITAHARA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
=== [[:Category:Joonas Govenius|Joonas Govenius]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
=== [[:Category:Jukka-Pekka Kaikkonen|Jukka-Pekka Kaikkonen]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
=== [[:Category:Chun-Fu YANG|Chun-Fu YANG]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Pei-Cheng HSU|Pei-Cheng HSU]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Ta-Cheng LIEN|Ta-Cheng LIEN]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Hsin-Chang LEE|Hsin-Chang LEE]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Shinji HIMORI|Shinji HIMORI]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250069851. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250227)
=== [[:Category:Justin Moses|Justin Moses of Austin TX (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
=== [[:Category:Chelsea DuBose|Chelsea DuBose of Austin TX (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
=== [[:Category:You Bong LIM|You Bong LIM]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:PLASMAPP CO., LTD.|PLASMAPP CO., LTD.]]: 1 patents
* Recent patents:
** [[20250069855. PACKAGING CONTAINER, PLASMA PROCESSING APPARATUS AND PROCESSING METHOD (PLASMAPP CO., LTD.)]] (20250227)
=== [[:Category:Jun Young KIM|Jun Young KIM]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:PLASMAPP CO., LTD.|PLASMAPP CO., LTD.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250069855. PACKAGING CONTAINER, PLASMA PROCESSING APPARATUS AND PROCESSING METHOD (PLASMAPP CO., LTD.)]] (20250227)
** [[20250104974. Plasma Processing Device (Tokyo Electron Limited)]] (20250327)
** [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)


== Top Collaborations in Plasma Technology ==
== Top Collaborations in Plasma Technology ==
Line 531: Line 563:
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]


* Miyagi: 31 inventors
* Miyagi: 58 inventors
* Tokyo: 26 inventors
* Tokyo: 45 inventors
* Suwon-si: 19 inventors
* Suwon-si: 29 inventors
* Austin: 15 inventors
* San Jose: 19 inventors
* Shanghai: 17 inventors
* Austin: 16 inventors
* Hsinchu: 15 inventors
* Hsinchu: 15 inventors
* San Jose: 14 inventors
* Yamanashi: 12 inventors
* Newark: 8 inventors
* Sunnyvale: 11 inventors
* Shanghai: 7 inventors
* Newark: 10 inventors
* Sunnyvale: 7 inventors
* Santa Clara: 6 inventors
* Kurokawa-gun: 6 inventors
* OSAKA: 6 inventors
* OSAKA: 6 inventors
* Madison: 6 inventors
* Chigasaki-shi: 5 inventors
* Chigasaki-shi: 5 inventors
* Fremont: 5 inventors
* Taoyuan: 5 inventors
* Taoyuan: 5 inventors
* Pleasanton: 5 inventors
* Jiangsu: 5 inventors
* Osaka: 5 inventors
* Osaka: 5 inventors
* Santa Clara: 4 inventors
* Hsinchu City: 4 inventors
* Fremont: 4 inventors
* New Taipei: 4 inventors
* Espoo: 3 inventors
* Daejeon: 3 inventors
* Kurokawa-gun: 3 inventors


[[Category:Plasma Technology]]
[[Category:Plasma Technology]]
[[Category:Patent Application Trends by Technology in 2025]]
[[Category:Patent Application Trends by Technology in 2025]]

Latest revision as of 21:05, 7 April 2025

Plasma Technology Patent Application Filing Activity

Plasma Technology patent applications in 2025

Top Technology Areas in Plasma Technology

Top CPC Codes

Top Companies in Plasma Technology 2025

Tokyo Electron Limited

Applied Materials, Inc.

Hitachi High-Tech Corporation

Taiwan Semiconductor Manufacturing Company, Ltd.

HITACHI HIGH-TECH CORPORATION

ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA

SAMSUNG ELECTRONICS CO., LTD.

Panasonic Intellectual Property Management Co., Ltd.

Lam Research Corporation

Beijing E-Town Semiconductor Technology Co., Ltd.

New Companies in Plasma Technology (Last Month)

File:New Companies in Plasma Technology Last Month.png

No new companies detected in the last month.

Emerging Technology Areas in Plasma Technology

Top Companies in Emerging Plasma Technology Technologies 2025

Top Inventors in Plasma Technology

Taro IKEDA

Barton Lane of Austin TX (US)

Chishio KOSHIMIZU

Kartik RAMASWAMY of San Jose CA (US)

Takashi ARAMAKI

Lifu LI

Kenichi KUWAHARA

Eiki KAMATA

Masaki HIRAYAMA

Merritt Funk of Austin TX (US)

Chih-Teng LIAO

Jonghwa LEE

Jawon KO

Taijo JEON

Yunsong JEONG

Kazushi KANEKO

Takahiro SHINDO

Yue GUO of Redwood City CA (US)

Yang YANG of San Diego CA (US)

A N M Wasekul AZAD of Santa Clara CA (US)

Nicolas J. BRIGHT of Arlington WA (US)

Shogo OKITA

Takahiro MIYAI

Naoaki TAKEDA

Toshiyuki TAKASAKI

Hisao NAGAI

Seiya NAGANO

Alok Ranjan of Austin TX (US)

Tzu-Ging Lin

Nathan STAFFORD of Newark DE (US)

Colin JENNINGS of Newark DE (US)

Scott BILTEK of Newark DE (US)

Phong NGUYEN of Newark DE (US)

Peter Lowell George Ventzek of Austin TX (US)

Mitsunori Ohata

Satoshi UNE

Nobutaka SASAKI

Toshiki AKAMA

Shusei KATO

Gyeong min PARK

Maolin Long of Santa Clara CA (US)

Sho KUMAKURA

Soichiro KIMURA

Koyumi SASA

Nobuhiro ODASHIMA

Yuji MASAKI

Noboru TAKEMOTO

Makoto KOBAYASHI

Alexei Marakhtanov of Albany CA (US)

Toshifumi KITAHARA

Top Collaborations in Plasma Technology

Top US States for Plasma Technology Inventors


Top Cities for Plasma Technology Inventors

  • Miyagi: 58 inventors
  • Tokyo: 45 inventors
  • Suwon-si: 29 inventors
  • San Jose: 19 inventors
  • Shanghai: 17 inventors
  • Austin: 16 inventors
  • Hsinchu: 15 inventors
  • Yamanashi: 12 inventors
  • Sunnyvale: 11 inventors
  • Newark: 10 inventors
  • Santa Clara: 6 inventors
  • Kurokawa-gun: 6 inventors
  • OSAKA: 6 inventors
  • Madison: 6 inventors
  • Chigasaki-shi: 5 inventors
  • Fremont: 5 inventors
  • Taoyuan: 5 inventors
  • Pleasanton: 5 inventors
  • Jiangsu: 5 inventors
  • Osaka: 5 inventors
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