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== Plasma Technology Patent Application Filing Activity ==
== Plasma Technology Patent Application Filing Activity ==
== Plasma Technology patent applications in 2025 ==
== Plasma Technology patent applications in 2025 ==
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_January 2025.png|border|800px]]
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_March 2025.png|border|800px]]


== Top Technology Areas in Plasma Technology ==
== Top Technology Areas in Plasma Technology ==
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_January 2025.png|border|800px]]
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_March 2025.png|border|800px]]


=== Top CPC Codes ===
=== Top CPC Codes ===
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps)
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available)
** Count: 10 patents
** Count: 28 patents
** Example: [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]]
** Example: [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]]
* [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits})
* [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available)
** Count: 9 patents
** Count: 19 patents
** Example: [[20250069851. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available)
** Count: 17 patents
** Example: [[20250069858. PLASMA PROCESSING APPARATUS AND CONTROL METHOD THEREFOR (ULVAC, INC.)]]
* [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available)
** Count: 15 patents
** Example: [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]]
** Example: [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]]
* [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available)
** Count: 9 patents
** Count: 14 patents
** Example: [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 8 patents
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available)
** Count: 6 patents
** Count: 14 patents
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available)
** Count: 5 patents
** Count: 10 patents
** Example: [[20250006461. Plasma Processing Apparatus (Tokyo Electron Limited)]]
** Example: [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01L21/31116|H01L21/31116]] (No explanation available)
** Count: 5 patents
** Count: 10 patents
** Example: [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
** Example: [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/3211|H01J37/3211]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01L21/3065|H01L21/3065]] (No explanation available)
** Count: 4 patents
** Count: 10 patents
** Example: [[20250006461. Plasma Processing Apparatus (Tokyo Electron Limited)]]
** Example: [[20250006537. Plasma Etching Method and Apparatus (SPTS Technologies Limited)]]
* [[:Category:CPC_H01J37/321|H01J37/321]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32724|H01J37/32724]] (No explanation available)
** Count: 4 patents
** Count: 8 patents
** Example: [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]]
** Example: [[20250069860. PLASMA PROCESSING METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)]]
* [[:Category:CPC_H01L21/6833|H01L21/6833]] (for supporting or gripping  (for conveying)
** Count: 4 patents
** Example: [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]


== Top Companies in Plasma Technology 2025 ==
== Top Companies in Plasma Technology 2025 ==
Line 42: Line 42:


=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
* Number of Plasma Technology patents: 19
* Number of Plasma Technology patents: 42
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (Gas-filled discharge tubes  (heating by discharge): 5 patents
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 9 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 5 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 9 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge): 4 patents
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 9 patents
* Recent patents:
* Recent patents:
** [[20250014866. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250109)
** [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
** [[20250014872. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
** [[20250014874. ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
* Number of Plasma Technology patents: 5
* Number of Plasma Technology patents: 12
* Top CPC codes:
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 5 patents
** [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available): 4 patents
** [[:Category:CPC_H01J37/32935|H01J37/32935]] (No explanation available): 3 patents
* Recent patents:
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
** [[20250112029. SUPPRESSING HEATING OF A PLASMA PROCESSING CHAMBER LID (Applied Materials, Inc.)]] (20250403)
** [[20250112076. GROUND ELECTRODE FORMED IN AN ELECTROSTATIC CHUCK FOR A PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20250403)
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
* Number of Plasma Technology patents: 7
* Top CPC codes:
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 5 patents
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available): 2 patents
* Recent patents:
** [[20250087497. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250313)
** [[20250104981. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
** [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
* Number of Plasma Technology patents: 4
* Top CPC codes:
** [[:Category:CPC_H01L29/66545|H01L29/66545]] (No explanation available): 2 patents
** [[:Category:CPC_H01L21/3065|H01L21/3065]] (No explanation available): 2 patents
** [[:Category:CPC_G03F1/82|G03F1/82]] (No explanation available): 1 patents
* Recent patents:
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250079177. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250306)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
* Number of Plasma Technology patents: 4
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits}): 2 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 2 patents
** [[:Category:CPC_H01L21/31116|H01L21/31116]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32935|H01J37/32935]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J2237/332|H01J2237/332]] (No explanation available): 2 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250079136. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250306)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250095981. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250320)
** [[20250022697. PLASMA SYSTEM HAVING RESIDENCE TIME TUNING ASSEMBLY (Applied Materials, Inc.)]] (20250116)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
=== [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]] ===
=== [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32082|H01J37/32082]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32082|H01J37/32082]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32513|H01J37/32513]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32513|H01J37/32513]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32568|H01J37/32568]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32568|H01J37/32568]] (No explanation available): 1 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250109)
** [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250109)
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
=== [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]] ===
* Number of Plasma Technology patents: 2
* Top CPC codes:
** [[:Category:CPC_H01J37/32522|H01J37/32522]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32201|H01J37/32201]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
* Recent patents:
** [[20250046580. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250206)
** [[20250046582. REGENERATING METHOD FOR INNER MEMBER OF PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250206)
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01L21/32136|H01L21/32136]] ({using plasmas}): 1 patents
** [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J2237/2007|H01J2237/2007]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J2237/202|H01J2237/202]] (No explanation available): 2 patents
* Recent patents:
* Recent patents:
** [[20250046620. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250206)
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]] ===
=== [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/3211|H01J37/3211]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J37/3211|H01J37/3211]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/3299|H01J37/3299]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/3299|H01J37/3299]] (No explanation available): 1 patents
* Recent patents:
* Recent patents:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
=== [[:Category:Lam Research Corporation|Lam Research Corporation]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01L29/66545|H01L29/66545]] ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 2 patents
** [[:Category:CPC_H01J37/32091|H01J37/32091]] (No explanation available): 2 patents
** [[:Category:CPC_H01L21/30655|H01L21/30655]] (Plasma etching; Reactive-ion etching): 1 patents
** [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available): 2 patents
** [[:Category:CPC_H01L21/76232|H01L21/76232]] (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available): 1 patents
* Recent patents:
* Recent patents:
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250087458. TUNING VOLTAGE SETPOINT IN A PULSED RF SIGNAL FOR A TUNABLE EDGE SHEATH SYSTEM (Lam Research Corporation)]] (20250313)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
** [[20250054730. Systems and Methods for Extracting Process Control Information from Radiofrequency Supply System of Plasma Processing System (Lam Research Corporation)]] (20250213)
=== [[:Category:Research & Business Foundation SUNGKYUNKWAN UNIVERSITY|Research & Business Foundation SUNGKYUNKWAN UNIVERSITY]] ===
=== [[:Category:Beijing E-Town Semiconductor Technology Co., Ltd.|Beijing E-Town Semiconductor Technology Co., Ltd.]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_A61K9/1271|A61K9/1271]] (PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES  (devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms): 1 patents
** [[:Category:CPC_H01J37/32651|H01J37/32651]] (No explanation available): 1 patents
** [[:Category:CPC_B01J19/087|B01J19/087]] (Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor  (application of shock waves): 1 patents
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32422|H01J37/32422]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32596|H01J37/32596]] (No explanation available): 1 patents
* Recent patents:
* Recent patents:
** [[20250009661. PLASMA COATING METHOD OF NANOVESICLE SURFACE AND PLASMA JET DEVICE FOR PLASMA COATING OF NANOVESICLE SURFACE (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]] (20250109)
** [[20250112030. PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20250403)
** [[20250014868. ETCHING PLASMA PROCESSING APPARATUS INCLUDING CONSUMABLE METAL MEMBER (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]] (20250109)
** [[20250014935. ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20250109)
=== [[:Category:Impinj, Inc.|Impinj, Inc.]] ===
* Number of Plasma Technology patents: 1
* Top CPC codes:
** [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
** [[:Category:CPC_G06K19/07722|G06K19/07722]] (Constructional details, e.g. mounting of circuits in the carrier): 1 patents
** [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
=== [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]] ===
* Number of Plasma Technology patents: 1
* Top CPC codes:
** [[:Category:CPC_H10N60/0912|H10N60/0912]] (No explanation available): 1 patents
** [[:Category:CPC_H10N60/12|H10N60/12]] (No explanation available): 1 patents
** [[:Category:CPC_H10N60/85|H10N60/85]] (No explanation available): 1 patents
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)


== New Companies in Plasma Technology (Last Month) ==
== New Companies in Plasma Technology (Last Month) ==
Line 140: Line 145:
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]


* [[:Category:CPC_H01L29/7851|H01L29/7851]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
* [[:Category:CPC_H01L21/32051|H01L21/32051]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
** Example: [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01L29/66795|H01L29/66795]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
* [[:Category:CPC_H01J37/3288|H01J37/3288]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
** Example: [[20250104981. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01J37/32981|H01J37/32981]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01L21/6831|H01L21/6831]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]]
** Example: [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32926|H01J37/32926]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01L21/67259|H01L21/67259]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]]
** Example: [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32165|H01J37/32165]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_C23C16/50|C23C16/50]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
* [[:Category:CPC_C23C28/042|C23C28/042]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion)
* [[:Category:CPC_C23C16/45565|C23C16/45565]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
* [[:Category:CPC_C23C14/46|C23C14/46]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion)
* [[:Category:CPC_H05H2245/30|H05H2245/30]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/30|C23C14/30]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion)
* [[:Category:CPC_H05H1/26|H05H1/26]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/26|C23C14/26]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion)
* [[:Category:CPC_A61P35/00|A61P35/00]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/0694|C23C14/0694]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion)
* [[:Category:CPC_A61K47/6913|A61K47/6913]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]


== Top Companies in Emerging Plasma Technology Technologies 2025==
== Top Companies in Emerging Plasma Technology Technologies 2025==
[[File:Top_Companies_in_Emerging_Plasma_Technology_Technologies.png|border|800px]]
[[File:Top_Companies_in_Emerging_Plasma_Technology_Technologies.png|border|800px]]


* [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 5 patents
* [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
* [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
* [[:Category:Wisconsin Alumni Research Foundation|Wisconsin Alumni Research Foundation]]: 4 patents
* [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 2 patents
* [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents


== Top Inventors in Plasma Technology ==
== Top Inventors in Plasma Technology ==
[[File:Top_50_Inventors_in_Plasma_Technology.png|border|800px]]
[[File:Top_50_Inventors_in_Plasma_Technology.png|border|800px]]


=== [[:Category:Taro IKEDA|Taro IKEDA]] ===
* Number of Plasma Technology patents: 5
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
* Recent patents:
** [[20250104974. Plasma Processing Device (Tokyo Electron Limited)]] (20250327)
** [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
* Number of Plasma Technology patents: 3
* Number of Plasma Technology patents: 4
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
* Recent patents:
* Recent patents:
** [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250130)
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
** [[20250022688. PLASMA PROCESSING METHOD AND APPARATUS (Tokyo Electron Limited)]] (20250116)
** [[20250022688. PLASMA PROCESSING METHOD AND APPARATUS (Tokyo Electron Limited)]] (20250116)
** [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250109)
** [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Chishio KOSHIMIZU|Chishio KOSHIMIZU]] ===
* Number of Plasma Technology patents: 4
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
* Recent patents:
** [[20250069863. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250227)
** [[20250062101. CONTROL METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250220)
** [[20250014872. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] ===
=== [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Takashi ARAMAKI|Takashi ARAMAKI]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
** [[20250112031. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND CLEANING METHOD (Tokyo Electron Limited)]] (20250403)
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Lifu LI|Lifu LI]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
** [[20250112031. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND CLEANING METHOD (Tokyo Electron Limited)]] (20250403)
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Kenichi KUWAHARA|Kenichi KUWAHARA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
** [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]]: 1 patents
* Recent patents:
** [[20250095963. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250320)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
** [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
=== [[:Category:Eiki KAMATA|Eiki KAMATA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250095973. Plasma Processing Apparatus and Method for Measuring Resonance Frequency (Tokyo Electron Limited)]] (20250320)
** [[20250104972. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250014863. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250014864. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104971. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Merritt Funk|Merritt Funk of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
** [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Chih-Teng LIAO|Chih-Teng LIAO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]: 1 patents
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
** [[20250069860. PLASMA PROCESSING METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)]] (20250227)
** [[20250079177. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250306)
=== [[:Category:Jonghwa LEE|Jonghwa LEE]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Jawon KO|Jawon KO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Taijo JEON|Taijo JEON]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Yunsong JEONG|Yunsong JEONG]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Kazushi KANEKO|Kazushi KANEKO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20250102)
** [[20250095973. Plasma Processing Apparatus and Method for Measuring Resonance Frequency (Tokyo Electron Limited)]] (20250320)
=== [[:Category:Takahiro SHINDO|Takahiro SHINDO]] ===
=== [[:Category:Takahiro SHINDO|Takahiro SHINDO]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 204: Line 316:
** [[20250006471. NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250006471. NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250046575. Plasma Processing Device (Tokyo Electron Limited)]] (20250206)
** [[20250046575. Plasma Processing Device (Tokyo Electron Limited)]] (20250206)
=== [[:Category:Yue GUO|Yue GUO of Redwood City CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Yang YANG|Yang YANG of San Diego CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:A N M Wasekul AZAD|A N M Wasekul AZAD of Santa Clara CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Nicolas J. BRIGHT|Nicolas J. BRIGHT of Arlington WA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Shogo OKITA|Shogo OKITA]] ===
=== [[:Category:Shogo OKITA|Shogo OKITA]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 246: Line 386:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
=== [[:Category:Alok Ranjan|Alok Ranjan of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250022689. GAS CLUSTER ASSISTED PLASMA PROCESSING (Tokyo Electron Limited)]] (20250116)
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Tzu-Ging Lin|Tzu-Ging Lin]] ===
=== [[:Category:Tzu-Ging Lin|Tzu-Ging Lin]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 253: Line 400:
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
=== [[:Category:Nathan STAFFORD|Nathan STAFFORD of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250014863. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250014864. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Tuqiang NI|Tuqiang NI]] ===
=== [[:Category:Colin JENNINGS|Colin JENNINGS of Newark DE (US)]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Zhihao WANG|Zhihao WANG]] ===
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
* Number of Plasma Technology patents: 1
=== [[:Category:Scott BILTEK|Scott BILTEK of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Kailin WANG|Kailin WANG]] ===
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
* Number of Plasma Technology patents: 1
=== [[:Category:Phong NGUYEN|Phong NGUYEN of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:David Coumou|David Coumou of Webster NY (US)]] ===
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
* Number of Plasma Technology patents: 1
=== [[:Category:Peter Lowell George Ventzek|Peter Lowell George Ventzek of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250079128. PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Zhi Wang|Zhi Wang of Sunnyvale CA (US)]] ===
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
* Number of Plasma Technology patents: 1
=== [[:Category:Mitsunori Ohata|Mitsunori Ohata]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250079128. PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Tao Zhang|Tao Zhang of San Ramon CA (US)]] ===
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
* Number of Plasma Technology patents: 1
=== [[:Category:Satoshi UNE|Satoshi UNE]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250079136. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250306)
=== [[:Category:David Peterson|David Peterson of San Jose CA (US)]] ===
** [[20250095981. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250320)
* Number of Plasma Technology patents: 1
=== [[:Category:Nobutaka SASAKI|Nobutaka SASAKI]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Mina T. FARAG|Mina T. FARAG of Cupertino CA (US)]] ===
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
* Number of Plasma Technology patents: 1
=== [[:Category:Toshiki AKAMA|Toshiki AKAMA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]] (20250130)
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Terry BLUCK|Terry BLUCK of Santa Clara CA (US)]] ===
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
* Number of Plasma Technology patents: 1
=== [[:Category:Shusei KATO|Shusei KATO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]] (20250130)
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
=== [[:Category:James GUZZO|James GUZZO]] ===
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
* Number of Plasma Technology patents: 1
=== [[:Category:Gyeong min PARK|Gyeong min PARK]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Harley K. HEINRICH|Harley K. HEINRICH of Seattle WA (US)]] ===
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
* Number of Plasma Technology patents: 1
=== [[:Category:Maolin Long|Maolin Long of Santa Clara CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
** [[:Category:Mattson Technology, Inc.|Mattson Technology, Inc.]]: 1 patents
** [[:Category:Beijing E-Town Semiconductor Technology Co., Ltd.|Beijing E-Town Semiconductor Technology Co., Ltd.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250062103. Cooled Shield for ICP Source (Mattson Technology, Inc.)]] (20250220)
=== [[:Category:Christopher J. DIORIO|Christopher J. DIORIO of Shoreline WA (US)]] ===
** [[20250014935. ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20250109)
* Number of Plasma Technology patents: 1
=== [[:Category:Sho KUMAKURA|Sho KUMAKURA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Janne Lehtinen|Janne Lehtinen]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Soichiro KIMURA|Soichiro KIMURA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Joonas Govenius|Joonas Govenius]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Koyumi SASA|Koyumi SASA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Jukka-Pekka Kaikkonen|Jukka-Pekka Kaikkonen]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Nobuhiro ODASHIMA|Nobuhiro ODASHIMA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Taro HAYAKAWA|Taro HAYAKAWA]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Yuji MASAKI|Yuji MASAKI]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006461. Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250102)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Kazushi KANEKO|Kazushi KANEKO]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Noboru TAKEMOTO|Noboru TAKEMOTO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20250102)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Yohei ISHIDA|Yohei ISHIDA]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Makoto KOBAYASHI|Makoto KOBAYASHI]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20250102)
** [[20250087454. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
=== [[:Category:Yang YANG|Yang YANG of Cupertino CA (US)]] ===
** [[20250087455. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Alexei Marakhtanov|Alexei Marakhtanov of Albany CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Lam Research Corporation|Lam Research Corporation]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250087458. TUNING VOLTAGE SETPOINT IN A PULSED RF SIGNAL FOR A TUNABLE EDGE SHEATH SYSTEM (Lam Research Corporation)]] (20250313)
=== [[:Category:Fernando SILVEIRA|Fernando SILVEIRA of Livermore CA (US)]] ===
** [[20250054730. Systems and Methods for Extracting Process Control Information from Radiofrequency Supply System of Plasma Processing System (Lam Research Corporation)]] (20250213)
* Number of Plasma Technology patents: 1
=== [[:Category:Toshifumi KITAHARA|Toshifumi KITAHARA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
=== [[:Category:Imad YOUSIF|Imad YOUSIF of San Jose CA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
=== [[:Category:Motohiro UMEHARA|Motohiro UMEHARA]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:KYOCERA Corporation|KYOCERA Corporation]]: 1 patents
* Recent patents:
** [[20250006468. PLASMA-RESISTANT LAMINATE, MANUFACTURING METHOD THEREFOR, AND PLASMA PROCESSING APPARATUS (KYOCERA Corporation)]] (20250102)
=== [[:Category:Wataru FUJITA|Wataru FUJITA]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:KYOCERA Corporation|KYOCERA Corporation]]: 1 patents
* Recent patents:
** [[20250006468. PLASMA-RESISTANT LAMINATE, MANUFACTURING METHOD THEREFOR, AND PLASMA PROCESSING APPARATUS (KYOCERA Corporation)]] (20250102)
=== [[:Category:Kazuhiro ISHIKAWA|Kazuhiro ISHIKAWA]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:KYOCERA Corporation|KYOCERA Corporation]]: 1 patents
* Recent patents:
** [[20250006468. PLASMA-RESISTANT LAMINATE, MANUFACTURING METHOD THEREFOR, AND PLASMA PROCESSING APPARATUS (KYOCERA Corporation)]] (20250102)
=== [[:Category:Takamichi KIKUCHI|Takamichi KIKUCHI]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250006471. NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
=== [[:Category:Yuki ONODERA|Yuki ONODERA]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250006473. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
=== [[:Category:Takamitsu TAKAYAMA|Takamitsu TAKAYAMA]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250006473. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
=== [[:Category:Noriiki MASUDA|Noriiki MASUDA]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
=== [[:Category:Adam S. BEACHEY|Adam S. BEACHEY]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:SPTS Technologies Limited|SPTS Technologies Limited]]: 1 patents
* Recent patents:
** [[20250006537. Plasma Etching Method and Apparatus (SPTS Technologies Limited)]] (20250102)
=== [[:Category:Jhih-Yan HE|Jhih-Yan HE]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
=== [[:Category:Li-Chun CHANG|Li-Chun CHANG]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
=== [[:Category:Jyh-Wei LEE|Jyh-Wei LEE]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
=== [[:Category:Ming-Hung CHEN|Ming-Hung CHEN]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
=== [[:Category:Mohd Fairuz BIN BUDIMAN|Mohd Fairuz BIN BUDIMAN]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250046573. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250206)
=== [[:Category:YUAN-CHI LEE|YUAN-CHI LEE]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 1 patents
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
=== [[:Category:PIN-CHUN LIU|PIN-CHUN LIU]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
** [[20250104974. Plasma Processing Device (Tokyo Electron Limited)]] (20250327)
=== [[:Category:MING-CHAN TSAI|MING-CHAN TSAI]] ===
** [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 1 patents
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
=== [[:Category:Yue GUO|Yue GUO of Redwood City CA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
=== [[:Category:Yang YANG|Yang YANG of San Diego CA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)


== Top Collaborations in Plasma Technology ==
== Top Collaborations in Plasma Technology ==
Line 505: Line 563:
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]


* Tokyo: 16 inventors
* Miyagi: 58 inventors
* Miyagi: 12 inventors
* Tokyo: 45 inventors
* Suwon-si: 11 inventors
* Suwon-si: 29 inventors
* San Jose: 8 inventors
* San Jose: 19 inventors
* Shanghai: 7 inventors
* Shanghai: 17 inventors
* Austin: 6 inventors
* Austin: 16 inventors
* Hsinchu: 15 inventors
* Yamanashi: 12 inventors
* Sunnyvale: 11 inventors
* Newark: 10 inventors
* Santa Clara: 6 inventors
* Kurokawa-gun: 6 inventors
* OSAKA: 6 inventors
* OSAKA: 6 inventors
* Madison: 6 inventors
* Chigasaki-shi: 5 inventors
* Fremont: 5 inventors
* Taoyuan: 5 inventors
* Taoyuan: 5 inventors
* Hsinchu: 5 inventors
* Pleasanton: 5 inventors
* Jiangsu: 5 inventors
* Osaka: 5 inventors
* Osaka: 5 inventors
* New Taipei: 4 inventors
* Santa Clara: 3 inventors
* Espoo: 3 inventors
* Taoyuan City: 3 inventors
* Fort Collins: 3 inventors
* Longmont: 3 inventors
* Sunnyvale: 2 inventors
* Cupertino: 2 inventors
* Taipei: 2 inventors
* Kaohsiung: 2 inventors


[[Category:Plasma Technology]]
[[Category:Plasma Technology]]
[[Category:Patent Application Trends by Technology in 2025]]
[[Category:Patent Application Trends by Technology in 2025]]

Latest revision as of 21:05, 7 April 2025

Plasma Technology Patent Application Filing Activity

Plasma Technology patent applications in 2025

Top Technology Areas in Plasma Technology

Top CPC Codes

Top Companies in Plasma Technology 2025

Tokyo Electron Limited

Applied Materials, Inc.

Hitachi High-Tech Corporation

Taiwan Semiconductor Manufacturing Company, Ltd.

HITACHI HIGH-TECH CORPORATION

ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA

SAMSUNG ELECTRONICS CO., LTD.

Panasonic Intellectual Property Management Co., Ltd.

Lam Research Corporation

Beijing E-Town Semiconductor Technology Co., Ltd.

New Companies in Plasma Technology (Last Month)

File:New Companies in Plasma Technology Last Month.png

No new companies detected in the last month.

Emerging Technology Areas in Plasma Technology

Top Companies in Emerging Plasma Technology Technologies 2025

Top Inventors in Plasma Technology

Taro IKEDA

Barton Lane of Austin TX (US)

Chishio KOSHIMIZU

Kartik RAMASWAMY of San Jose CA (US)

Takashi ARAMAKI

Lifu LI

Kenichi KUWAHARA

Eiki KAMATA

Masaki HIRAYAMA

Merritt Funk of Austin TX (US)

Chih-Teng LIAO

Jonghwa LEE

Jawon KO

Taijo JEON

Yunsong JEONG

Kazushi KANEKO

Takahiro SHINDO

Yue GUO of Redwood City CA (US)

Yang YANG of San Diego CA (US)

A N M Wasekul AZAD of Santa Clara CA (US)

Nicolas J. BRIGHT of Arlington WA (US)

Shogo OKITA

Takahiro MIYAI

Naoaki TAKEDA

Toshiyuki TAKASAKI

Hisao NAGAI

Seiya NAGANO

Alok Ranjan of Austin TX (US)

Tzu-Ging Lin

Nathan STAFFORD of Newark DE (US)

Colin JENNINGS of Newark DE (US)

Scott BILTEK of Newark DE (US)

Phong NGUYEN of Newark DE (US)

Peter Lowell George Ventzek of Austin TX (US)

Mitsunori Ohata

Satoshi UNE

Nobutaka SASAKI

Toshiki AKAMA

Shusei KATO

Gyeong min PARK

Maolin Long of Santa Clara CA (US)

Sho KUMAKURA

Soichiro KIMURA

Koyumi SASA

Nobuhiro ODASHIMA

Yuji MASAKI

Noboru TAKEMOTO

Makoto KOBAYASHI

Alexei Marakhtanov of Albany CA (US)

Toshifumi KITAHARA

Top Collaborations in Plasma Technology

Top US States for Plasma Technology Inventors


Top Cities for Plasma Technology Inventors

  • Miyagi: 58 inventors
  • Tokyo: 45 inventors
  • Suwon-si: 29 inventors
  • San Jose: 19 inventors
  • Shanghai: 17 inventors
  • Austin: 16 inventors
  • Hsinchu: 15 inventors
  • Yamanashi: 12 inventors
  • Sunnyvale: 11 inventors
  • Newark: 10 inventors
  • Santa Clara: 6 inventors
  • Kurokawa-gun: 6 inventors
  • OSAKA: 6 inventors
  • Madison: 6 inventors
  • Chigasaki-shi: 5 inventors
  • Fremont: 5 inventors
  • Taoyuan: 5 inventors
  • Pleasanton: 5 inventors
  • Jiangsu: 5 inventors
  • Osaka: 5 inventors
Retrieved from "https://wikipatents.org/index.php?title=Plasma_Technology_Patent_Application_Trends_2025&oldid=470257"

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