Samsung electronics co., ltd. (20250062177). SEMICONDUCTOR PACKAGE: Difference between revisions
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[[Category:samsung electronics co., ltd.]] | [[Category:samsung electronics co., ltd.]] | ||
==Inventor(s)== | |||
[[:Category:Han Min Lee of Suwon-si (KR)|Han Min Lee of Suwon-si (KR)]][[Category:Han Min Lee of Suwon-si (KR)]] | |||
[[:Category:Sang-Sick Park of Suwon-si (KR)|Sang-Sick Park of Suwon-si (KR)]][[Category:Sang-Sick Park of Suwon-si (KR)]] | |||
[[:Category:Un-Byoung Kang of Suwon-si (KR)|Un-Byoung Kang of Suwon-si (KR)]][[Category:Un-Byoung Kang of Suwon-si (KR)]] | |||
[[:Category:Ku Young Kim of Suwon-si (KR)|Ku Young Kim of Suwon-si (KR)]][[Category:Ku Young Kim of Suwon-si (KR)]] | |||
==SEMICONDUCTOR PACKAGE== | |||
This abstract first appeared for US patent application 20250062177 titled 'SEMICONDUCTOR PACKAGE | |||
==Original Abstract Submitted== | |||
a semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a second semiconductor chip on the first semiconductor chip, an upper pad on an upper surface of the first semiconductor chip, a lower pad on a lower surface of the second semiconductor chip that faces the upper surface of the first semiconductor chip, a connecting bump between the upper pad and the lower pad, a lower film on the upper surface of the first semiconductor chip, and on a side surface of the upper pad and an upper film between the lower film and the lower surface of the second semiconductor chip, and on a side surface of the lower pad, wherein the lower film includes a thermosetting material, the upper film includes a photocurable material, and a side surface of the lower film protrudes outward beyond a side surface of the first semiconductor chip. | |||
[[Category:H01L23/31]] | |||
[[Category:H01L21/56]] | |||
[[Category:H01L23/00]] | |||
[[Category:H01L25/00]] | |||
[[Category:H01L25/065]] | |||
[[Category:H01L25/18]] | |||
[[Category:CPC_H01L23/3192]] | |||
Latest revision as of 03:56, 19 March 2025
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sang-Sick Park of Suwon-si (KR)
Un-Byoung Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250062177 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a second semiconductor chip on the first semiconductor chip, an upper pad on an upper surface of the first semiconductor chip, a lower pad on a lower surface of the second semiconductor chip that faces the upper surface of the first semiconductor chip, a connecting bump between the upper pad and the lower pad, a lower film on the upper surface of the first semiconductor chip, and on a side surface of the upper pad and an upper film between the lower film and the lower surface of the second semiconductor chip, and on a side surface of the lower pad, wherein the lower film includes a thermosetting material, the upper film includes a photocurable material, and a side surface of the lower film protrudes outward beyond a side surface of the first semiconductor chip.