Samsung electronics co., ltd. (20250062177). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sang-Sick Park of Suwon-si (KR)
Un-Byoung Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250062177 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a second semiconductor chip on the first semiconductor chip, an upper pad on an upper surface of the first semiconductor chip, a lower pad on a lower surface of the second semiconductor chip that faces the upper surface of the first semiconductor chip, a connecting bump between the upper pad and the lower pad, a lower film on the upper surface of the first semiconductor chip, and on a side surface of the upper pad and an upper film between the lower film and the lower surface of the second semiconductor chip, and on a side surface of the lower pad, wherein the lower film includes a thermosetting material, the upper film includes a photocurable material, and a side surface of the lower film protrudes outward beyond a side surface of the first semiconductor chip.