Samsung electronics co., ltd. (20250087599). SEMICONDUCTOR PACKAGE: Difference between revisions
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[[Category:samsung electronics co., ltd.]] | [[Category:samsung electronics co., ltd.]] | ||
==Inventor(s)== | |||
[[:Category:Seung Hyun Baik of Suwon-si (KR)|Seung Hyun Baik of Suwon-si (KR)]][[Category:Seung Hyun Baik of Suwon-si (KR)]] | |||
==SEMICONDUCTOR PACKAGE== | |||
This abstract first appeared for US patent application 20250087599 titled 'SEMICONDUCTOR PACKAGE | |||
==Original Abstract Submitted== | |||
a semiconductor package includes a package substrate. a ceramic electronic component is electrically connected to the package substrate. the ceramic electronic component includes a main body having a main body upper surface and a first electrode disposed on a first side of the main body. the first side of the main body includes a first upper area disposed on the main body upper surface. a second electrode is disposed on an opposite second side of the main body. the second side of the main body includes a second upper area disposed on the main body upper surface. the second upper area is spaced apart from the first upper area. a protection unit is disposed on the main body upper surface and is positioned between the first and second upper areas. a mold unit seals the ceramic electronic component and the protection unit. | |||
[[Category:H01L23/00]] | |||
[[Category:H01L23/31]] | |||
[[Category:H01L25/065]] | |||
[[Category:H01L25/16]] | |||
[[Category:CPC_H01L23/562]] | |||
Latest revision as of 02:10, 15 March 2025
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seung Hyun Baik of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250087599 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a package substrate. a ceramic electronic component is electrically connected to the package substrate. the ceramic electronic component includes a main body having a main body upper surface and a first electrode disposed on a first side of the main body. the first side of the main body includes a first upper area disposed on the main body upper surface. a second electrode is disposed on an opposite second side of the main body. the second side of the main body includes a second upper area disposed on the main body upper surface. the second upper area is spaced apart from the first upper area. a protection unit is disposed on the main body upper surface and is positioned between the first and second upper areas. a mold unit seals the ceramic electronic component and the protection unit.