Samsung electronics co., ltd. (20250087599). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seung Hyun Baik of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250087599 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a package substrate. a ceramic electronic component is electrically connected to the package substrate. the ceramic electronic component includes a main body having a main body upper surface and a first electrode disposed on a first side of the main body. the first side of the main body includes a first upper area disposed on the main body upper surface. a second electrode is disposed on an opposite second side of the main body. the second side of the main body includes a second upper area disposed on the main body upper surface. the second upper area is spaced apart from the first upper area. a protection unit is disposed on the main body upper surface and is positioned between the first and second upper areas. a mold unit seals the ceramic electronic component and the protection unit.