Difference between revisions of "Plasma Technology Patent Application Trends 2024"
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== Plasma Technology Patent Application Filing Activity == | == Plasma Technology Patent Application Filing Activity == | ||
== Plasma Technology patent applications in 2024 == | == Plasma Technology patent applications in 2024 == | ||
| − | [[File:Plasma_Technology_Monthly_Patent_Applications_2024_- | + | [[File:Plasma_Technology_Monthly_Patent_Applications_2024_-_Up_to_November 2024.png|border|800px]] |
== Top Technology Areas in Plasma Technology == | == Top Technology Areas in Plasma Technology == | ||
| − | [[File:Top_Technology_Areas_in_Plasma_Technology_2024_- | + | [[File:Top_Technology_Areas_in_Plasma_Technology_2024_-_Up_to_November 2024.png|border|800px]] |
=== Top CPC Codes === | === Top CPC Codes === | ||
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available) | * [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available) | ||
| − | ** Count: | + | ** Count: 78 patents |
| − | ** Example: [[20240234097. ETCHING METHOD AND PLASMA PROCESSING APPARATUS | + | ** Example: [[20240234097. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] |
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available) | * [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available) | ||
| − | ** Count: | + | ** Count: 66 patents |
| − | ** Example: [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD | + | ** Example: [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]] |
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available) | * [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available) | ||
| − | ** Count: | + | ** Count: 48 patents |
| − | ** Example: [[20240234113. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | + | ** Example: [[20240234113. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] |
* [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available) | * [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available) | ||
| − | ** Count: | + | ** Count: 45 patents |
| − | ** Example: [[20240234092. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS | + | ** Example: [[20240234092. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] |
* [[:Category:CPC_H01J37/32568|H01J37/32568]] (No explanation available) | * [[:Category:CPC_H01J37/32568|H01J37/32568]] (No explanation available) | ||
| − | ** Count: | + | ** Count: 39 patents |
| − | ** Example: [[20240234104. MULTI-SECTIONAL PLASMA CONFINEMENT RING STRUCTURE | + | ** Example: [[20240234104. MULTI-SECTIONAL PLASMA CONFINEMENT RING STRUCTURE (Lam Research Corporation)]] |
| + | * [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available) | ||
| + | ** Count: 36 patents | ||
| + | ** Example: [[20240234096. PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] | ||
* [[:Category:CPC_H01J37/32091|H01J37/32091]] (No explanation available) | * [[:Category:CPC_H01J37/32091|H01J37/32091]] (No explanation available) | ||
| − | ** Count: | + | ** Count: 35 patents |
| − | ** Example: [[20240234087. PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS | + | ** Example: [[20240234087. PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS (Applied Materials, Inc.)]] |
| + | * [[:Category:CPC_H01J37/32724|H01J37/32724]] (No explanation available) | ||
| + | ** Count: 34 patents | ||
| + | ** Example: [[20240234099. FORMING METHOD OF COMPONENT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] | ||
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available) | * [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available) | ||
| − | ** Count: | + | ** Count: 33 patents |
| − | ** Example: [[ | + | ** Example: [[20240258070. PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS (Applied Materials, Inc.)]] |
| − | + | * [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available) | |
| − | + | ** Count: 31 patents | |
| − | + | ** Example: [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]] | |
| − | |||
| − | |||
| − | |||
| − | * [[:Category:CPC_H01J37/ | ||
| − | ** Count: | ||
| − | ** Example: [[ | ||
== Top Companies in Plasma Technology == | == Top Companies in Plasma Technology == | ||
| Line 42: | Line 42: | ||
=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] === | === [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] === | ||
| − | * Number of Plasma Technology patents: | + | * Number of Plasma Technology patents: 162 |
* Top CPC codes: | * Top CPC codes: | ||
| − | ** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): | + | ** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 39 patents |
| − | ** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): | + | ** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 38 patents |
| − | ** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): | + | ** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 28 patents |
* Recent patents: | * Recent patents: | ||
| − | ** [[20240047182. PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK | + | ** [[20240047182. PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK (Tokyo Electron Limited)]] (20240208) |
| − | ** [[20240047184. PLASMA PROCESSING APPARATUS | + | ** [[20240047184. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240208) |
| − | ** [[20240049379. PLASMA PROCESSING APPARATUS | + | ** [[20240049379. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240208) |
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] === | === [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] === | ||
| − | * Number of Plasma Technology patents: | + | * Number of Plasma Technology patents: 36 |
* Top CPC codes: | * Top CPC codes: | ||
| − | ** [[:Category:CPC_H01J37/ | + | ** [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available): 11 patents |
| − | ** [[:Category:CPC_H01J37/ | + | ** [[:Category:CPC_H01J37/32128|H01J37/32128]] (No explanation available): 10 patents |
| − | ** [[:Category: | + | ** [[:Category:CPC_H01J2237/3341|H01J2237/3341]] (No explanation available): 8 patents |
* Recent patents: | * Recent patents: | ||
| − | ** [[ | + | ** [[20240321610. SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITOR (Applied Materials, Inc.)]] (20240926) |
| − | ** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER | + | ** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125) |
| − | ** [[20240047246. ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING CHAMBER | + | ** [[20240047246. ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240208) |
| + | === [[:Category:Lam Research Corporation|Lam Research Corporation]] === | ||
| + | * Number of Plasma Technology patents: 21 | ||
| + | * Top CPC codes: | ||
| + | ** [[:Category:CPC_H01L21/67069|H01L21/67069]] (No explanation available): 7 patents | ||
| + | ** [[:Category:CPC_H01L21/6833|H01L21/6833]] (No explanation available): 7 patents | ||
| + | ** [[:Category:CPC_H01L21/67109|H01L21/67109]] (No explanation available): 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240363311. RF POWER COMPENSATION TO REDUCE DEPOSITION OR ETCH RATE CHANGES IN RESPONSE TO SUBSTRATE BULK RESISTIVITY VARIATIONS (Lam Research Corporation)]] (20241031) | ||
| + | ** [[20240218509. MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA (Lam Research Corporation)]] (20240704) | ||
| + | ** [[20240322781. Multiple-Output Radiofrequency Matching Module and Associated Methods (Lam Research Corporation)]] (20240926) | ||
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] === | === [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] === | ||
| − | * Number of Plasma Technology patents: | + | * Number of Plasma Technology patents: 17 |
* Top CPC codes: | * Top CPC codes: | ||
| + | ** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 4 patents | ||
** [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available): 3 patents | ** [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available): 3 patents | ||
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 3 patents | ** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 3 patents | ||
| − | |||
* Recent patents: | * Recent patents: | ||
| − | ** [[20240047181. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | + | ** [[20240047181. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20240208) |
| − | ** [[20240047239. PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD | + | ** [[20240047239. PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20240208) |
| − | ** [[20240047258. PLASMA PROCESSING APPARATUS | + | ** [[20240047258. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20240208) |
=== [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]] === | === [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]] === | ||
| − | * Number of Plasma Technology patents: | + | * Number of Plasma Technology patents: 14 |
* Top CPC codes: | * Top CPC codes: | ||
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 3 patents | ** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 3 patents | ||
** [[:Category:CPC_H01J37/32247|H01J37/32247]] (No explanation available): 3 patents | ** [[:Category:CPC_H01J37/32247|H01J37/32247]] (No explanation available): 3 patents | ||
| − | ** [[:Category:CPC_H01J37/ | + | ** [[:Category:CPC_H01J37/32513|H01J37/32513]] (No explanation available): 2 patents |
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
* Recent patents: | * Recent patents: | ||
| − | ** [[ | + | ** [[20240331977. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20241003) |
| − | ** [[ | + | ** [[20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240125) |
| − | ** [[ | + | ** [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)]] (20240125) |
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] === | === [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] === | ||
| − | * Number of Plasma Technology patents: | + | * Number of Plasma Technology patents: 11 |
* Top CPC codes: | * Top CPC codes: | ||
| − | ** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): | + | ** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 6 patents |
| − | ** [[:Category: | + | ** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 3 patents |
| − | ** [[:Category:CPC_H01J37/32972|H01J37/32972]] (No explanation available): | + | ** [[:Category:CPC_H01J37/32972|H01J37/32972]] (No explanation available): 3 patents |
* Recent patents: | * Recent patents: | ||
| − | ** [[ | + | ** [[20240194461. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20240613) |
| − | ** [[ | + | ** [[20240222096. PLASMA PROCESSING APPARATUS (HITACHI HIGH-TECH CORPORATION)]] (20240704) |
| − | ** [[ | + | ** [[20240331974. PLASMA PROCESSING APPARATUS (HITACHI HIGH-TECH CORPORATION)]] (20241003) |
=== [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]] === | === [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]] === | ||
| − | * Number of Plasma Technology patents: | + | * Number of Plasma Technology patents: 7 |
* Top CPC codes: | * Top CPC codes: | ||
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 3 patents | ** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 3 patents | ||
| + | ** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 3 patents | ||
** [[:Category:CPC_H01J37/3211|H01J37/3211]] (No explanation available): 2 patents | ** [[:Category:CPC_H01J37/3211|H01J37/3211]] (No explanation available): 2 patents | ||
| − | |||
* Recent patents: | * Recent patents: | ||
| − | ** [[20240212992. PLASMA PROCESSING APPARATUS AND METHOD | + | ** [[20240212992. PLASMA PROCESSING APPARATUS AND METHOD (SAMSUNG ELECTRONICS CO., LTD.)]] (20240627) |
| − | ** [[20240096649. SEMICONDUCTOR PROCESS SYSTEM AND GAS TREATMENT METHOD | + | ** [[20240096649. SEMICONDUCTOR PROCESS SYSTEM AND GAS TREATMENT METHOD (SAMSUNG ELECTRONICS CO., LTD.)]] (20240321) |
| − | ** [[20240038536. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD | + | ** [[20240038536. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD (SAMSUNG ELECTRONICS CO., LTD.)]] (20240201) |
| + | === [[:Category:DISCO CORPORATION|DISCO CORPORATION]] === | ||
| + | * Number of Plasma Technology patents: 7 | ||
| + | * Top CPC codes: | ||
| + | ** [[:Category:CPC_H01L21/304|H01L21/304]] (No explanation available): 3 patents | ||
| + | ** [[:Category:CPC_H01L21/3065|H01L21/3065]] (No explanation available): 3 patents | ||
| + | ** [[:Category:CPC_H01L24/80|H01L24/80]] (No explanation available): 2 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240136193. METHOD OF PROCESSING WAFER (DISCO CORPORATION)]] (20240425) | ||
| + | ** [[20240058898. WAFER PROCESSING METHOD (DISCO CORPORATION)]] (20240222) | ||
| + | ** [[20240112955. MANUFACTURING METHOD OF CHIPS (DISCO CORPORATION)]] (20240404) | ||
=== [[:Category:Advanced Energy Industries, Inc.|Advanced Energy Industries, Inc.]] === | === [[:Category:Advanced Energy Industries, Inc.|Advanced Energy Industries, Inc.]] === | ||
| − | * Number of Plasma Technology patents: | + | * Number of Plasma Technology patents: 7 |
* Top CPC codes: | * Top CPC codes: | ||
| + | ** [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available): 2 patents | ||
** [[:Category:CPC_H01J37/32935|H01J37/32935]] (No explanation available): 2 patents | ** [[:Category:CPC_H01J37/32935|H01J37/32935]] (No explanation available): 2 patents | ||
** [[:Category:CPC_H01L21/67069|H01L21/67069]] (No explanation available): 2 patents | ** [[:Category:CPC_H01L21/67069|H01L21/67069]] (No explanation available): 2 patents | ||
| − | |||
* Recent patents: | * Recent patents: | ||
| − | ** [[20240071721. SYSTEM, METHOD, AND APPARATUS FOR CONTROLLING ION ENERGY DISTRIBUTION IN PLASMA PROCESSING SYSTEMS | + | ** [[20240071721. SYSTEM, METHOD, AND APPARATUS FOR CONTROLLING ION ENERGY DISTRIBUTION IN PLASMA PROCESSING SYSTEMS (Advanced Energy Industries, Inc.)]] (20240229) |
| − | ** [[20240194452. BIAS SUPPLY WITH RESONANT SWITCHING | + | ** [[20240194452. BIAS SUPPLY WITH RESONANT SWITCHING (Advanced Energy Industries, Inc.)]] (20240613) |
| − | ** [[20240030001. BIAS SUPPLY WITH A SINGLE CONTROLLED SWITCH | + | ** [[20240030001. BIAS SUPPLY WITH A SINGLE CONTROLLED SWITCH (Advanced Energy Industries, Inc.)]] (20240125) |
| − | === [[:Category: | + | === [[:Category:Beijing E-Town Semiconductor Technology Co., Ltd.|Beijing E-Town Semiconductor Technology Co., Ltd.]] === |
| − | * Number of Plasma Technology patents: | + | * Number of Plasma Technology patents: 6 |
* Top CPC codes: | * Top CPC codes: | ||
| − | ** [[:Category:CPC_H01J37/ | + | ** [[:Category:CPC_H01J37/32119|H01J37/32119]] (No explanation available): 3 patents |
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents | ** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents | ||
| − | ** [[:Category: | + | ** [[:Category:CPC_H01L21/6833|H01L21/6833]] (No explanation available): 2 patents |
* Recent patents: | * Recent patents: | ||
| − | ** [[ | + | ** [[20240055242. Workpiece Processing Apparatus with Thermal Processing Systems (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20240215) |
| − | ** [[ | + | ** [[20240096680. ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20240321) |
| − | ** [[ | + | ** [[20240071754. Enhanced Ignition in Inductively Coupled Plasmas For Workpiece Processing (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20240229) |
| − | |||
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| − | |||
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== New Companies in Plasma Technology (Last Month) == | == New Companies in Plasma Technology (Last Month) == | ||
| Line 150: | Line 150: | ||
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]] | [[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]] | ||
| − | |||
| − | |||
| − | |||
* [[:Category:CPC_H01L21/67063|H01L21/67063]] (No explanation available) | * [[:Category:CPC_H01L21/67063|H01L21/67063]] (No explanation available) | ||
** Count: 1 patents | ** Count: 1 patents | ||
| − | ** Example: [[20240047258. PLASMA PROCESSING APPARATUS | + | ** Example: [[20240047258. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] |
| − | * [[:Category: | + | * [[:Category:CPC_C23C4/04|C23C4/04]] (No explanation available) |
** Count: 1 patents | ** Count: 1 patents | ||
| − | ** Example: [[ | + | ** Example: [[20240043982. THERMAL SPRAY MATERIAL, THERMAL SPRAY COATING, METHOD FOR FORMING THERMAL SPRAY COATING, AND COMPONENT FOR PLASMA ETCHING DEVICE (TOCALO Co., Ltd.)]] |
| − | * [[:Category: | + | * [[:Category:CPC_G03F7/70633|G03F7/70633]] (No explanation available) |
** Count: 1 patents | ** Count: 1 patents | ||
| − | ** Example: [[ | + | ** Example: [[20240030073. ETCH MONITORING AND PERFORMING (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)]] |
* [[:Category:CPC_H01J2237/24578|H01J2237/24578]] (No explanation available) | * [[:Category:CPC_H01J2237/24578|H01J2237/24578]] (No explanation available) | ||
** Count: 1 patents | ** Count: 1 patents | ||
| − | ** Example: [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD | + | ** Example: [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)]] |
* [[:Category:CPC_G05B15/02|G05B15/02]] (No explanation available) | * [[:Category:CPC_G05B15/02|G05B15/02]] (No explanation available) | ||
** Count: 1 patents | ** Count: 1 patents | ||
| − | ** Example: [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD | + | ** Example: [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)]] |
* [[:Category:CPC_G01N25/72|G01N25/72]] (No explanation available) | * [[:Category:CPC_G01N25/72|G01N25/72]] (No explanation available) | ||
** Count: 1 patents | ** Count: 1 patents | ||
| − | ** Example: [[20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS | + | ** Example: [[20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] |
* [[:Category:CPC_G01M3/002|G01M3/002]] (No explanation available) | * [[:Category:CPC_G01M3/002|G01M3/002]] (No explanation available) | ||
** Count: 1 patents | ** Count: 1 patents | ||
| − | ** Example: [[20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS | + | ** Example: [[20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] |
* [[:Category:CPC_H01J2237/3342|H01J2237/3342]] (No explanation available) | * [[:Category:CPC_H01J2237/3342|H01J2237/3342]] (No explanation available) | ||
** Count: 1 patents | ** Count: 1 patents | ||
| − | ** Example: [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS | + | ** Example: [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] |
* [[:Category:CPC_H05B6/62|H05B6/62]] (No explanation available) | * [[:Category:CPC_H05B6/62|H05B6/62]] (No explanation available) | ||
** Count: 1 patents | ** Count: 1 patents | ||
| − | ** Example: [[20240030009. PLASMA PROCESSING APPARATUS AND TEMPERATURE CONTROLLING METHOD | + | ** Example: [[20240030009. PLASMA PROCESSING APPARATUS AND TEMPERATURE CONTROLLING METHOD (Tokyo Electron Limited)]] |
| + | * [[:Category:CPC_H05B6/54|H05B6/54]] (No explanation available) | ||
| + | ** Count: 1 patents | ||
| + | ** Example: [[20240030009. PLASMA PROCESSING APPARATUS AND TEMPERATURE CONTROLLING METHOD (Tokyo Electron Limited)]] | ||
== Top Companies in Emerging Plasma Technology Technologies == | == Top Companies in Emerging Plasma Technology Technologies == | ||
| Line 186: | Line 186: | ||
* [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents | * [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents | ||
* [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 2 patents | * [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 2 patents | ||
| − | * [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents | + | * [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 1 patents |
| − | * [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents | + | * [[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]: 1 patents |
| + | * [[:Category:TOCALO Co., Ltd.|TOCALO Co., Ltd.]]: 1 patents | ||
| + | |||
| + | == Top Inventors in Plasma Technology == | ||
| + | [[File:Top_50_Inventors_in_Plasma_Technology.png|border|800px]] | ||
| + | |||
| + | === [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 13 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 13 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240194447. LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240613) | ||
| + | ** [[20240152114. RADIO FREQUENCY IMPEDANCE MATCHING NETWORK WITH FLEXIBLE TUNING ALGORITHMS (Applied Materials, Inc.)]] (20240509) | ||
| + | ** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125) | ||
| + | === [[:Category:Yue GUO|Yue GUO of Redwood City CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 11 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 11 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240194447. LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240613) | ||
| + | ** [[20240152114. RADIO FREQUENCY IMPEDANCE MATCHING NETWORK WITH FLEXIBLE TUNING ALGORITHMS (Applied Materials, Inc.)]] (20240509) | ||
| + | ** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125) | ||
| + | === [[:Category:Taro IKEDA|Taro IKEDA]] === | ||
| + | * Number of Plasma Technology patents: 10 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 8 patents | ||
| + | ** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 2 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240170260. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240523) | ||
| + | ** [[20240038500. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240201) | ||
| + | ** [[20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240125) | ||
| + | === [[:Category:Chishio KOSHIMIZU|Chishio KOSHIMIZU]] === | ||
| + | * Number of Plasma Technology patents: 10 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 10 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240112895. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20240404) | ||
| + | ** [[20240087857. PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT (Tokyo Electron Limited)]] (20240314) | ||
| + | ** [[20240331978. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20241003) | ||
| + | === [[:Category:Sergey Voronin|Sergey Voronin of Albany NY (US)]] === | ||
| + | * Number of Plasma Technology patents: 8 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 8 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321) | ||
| + | ** [[20240096600. Substrate Bombardment with Ions having Targeted Mass using Pulsed Bias Phase Control (Tokyo Electron Limited)]] (20240321) | ||
| + | ** [[20240331979. Apparatus and Methods for Plasma Processing (Tokyo Electron Limited)]] (20241003) | ||
| + | === [[:Category:Yang YANG|Yang YANG of San Diego CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 8 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 8 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240177969. SOLID-STATE SWITCH BASED HIGH-SPEED PULSER WITH PLASMA IEDF MODIFICATION CAPABILITY THROUGH MULTILEVEL OUTPUT FUNCTIONALITY (Applied Materials, Inc.)]] (20240530) | ||
| + | ** [[20240194447. LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240613) | ||
| + | ** [[20240152114. RADIO FREQUENCY IMPEDANCE MATCHING NETWORK WITH FLEXIBLE TUNING ALGORITHMS (Applied Materials, Inc.)]] (20240509) | ||
| + | === [[:Category:Kazushi KANEKO|Kazushi KANEKO]] === | ||
| + | * Number of Plasma Technology patents: 8 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents | ||
| + | ** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 3 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240203692. PLASMA PROCESSING APPARATUS AND PLASMA CONTROL METHOD (Tokyo Electron Limited)]] (20240620) | ||
| + | ** [[20240371603. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, PLASMA PROCESSING METHOD, ANALYSIS METHOD, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20241107) | ||
| + | ** [[20240136154. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240425) | ||
| + | === [[:Category:Peter Lowell George Ventzek|Peter Lowell George Ventzek of Austin TX (US)]] === | ||
| + | * Number of Plasma Technology patents: 8 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 8 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240347317. Method and System for Plasma Processing (Tokyo Electron Limited)]] (20241017) | ||
| + | ** [[20240038506. Plasma Processing with Magnetic Ring X Point (Tokyo Electron Limited)]] (20240201) | ||
| + | ** [[20240363310. Balanced RF Resonant Antenna System (Tokyo Electron Limited)]] (20241031) | ||
| + | === [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] === | ||
| + | * Number of Plasma Technology patents: 7 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 6 patents | ||
| + | ** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 1 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240071730. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240229) | ||
| + | ** [[20240087849. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240314) | ||
| + | ** [[20240321550. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926) | ||
| + | === [[:Category:Eiki KAMATA|Eiki KAMATA]] === | ||
| + | * Number of Plasma Technology patents: 7 | ||
| + | * Top companies: | ||
| + | ** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 4 patents | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240170260. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240523) | ||
| + | ** [[20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240125) | ||
| + | ** [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)]] (20240125) | ||
| + | === [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] === | ||
| + | * Number of Plasma Technology patents: 6 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 6 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240203713. IN-SITU DIAGNOSIS OF PLASMA SYSTEM (Tokyo Electron Limited)]] (20240620) | ||
| + | ** [[20240213005. System and Method for Plasma Processing (Tokyo Electron Limited)]] (20240627) | ||
| + | ** [[20240038506. Plasma Processing with Magnetic Ring X Point (Tokyo Electron Limited)]] (20240201) | ||
| + | === [[:Category:Maju TOMURA|Maju TOMURA]] === | ||
| + | * Number of Plasma Technology patents: 6 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 6 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240153744. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509) | ||
| + | ** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926) | ||
| + | ** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125) | ||
| + | === [[:Category:Blaze Messer|Blaze Messer of Albany NY (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425) | ||
| + | ** [[20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited)]] (20240425) | ||
| + | ** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321) | ||
| + | === [[:Category:Yan Chen|Yan Chen of Fremont CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425) | ||
| + | ** [[20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited)]] (20240425) | ||
| + | ** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321) | ||
| + | === [[:Category:Joel Ng|Joel Ng of Fremont CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425) | ||
| + | ** [[20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited)]] (20240425) | ||
| + | ** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321) | ||
| + | === [[:Category:Ashawaraya Shalini|Ashawaraya Shalini of Fremont CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425) | ||
| + | ** [[20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited)]] (20240425) | ||
| + | ** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321) | ||
| + | === [[:Category:Ying Zhu|Ying Zhu of Fremont CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425) | ||
| + | ** [[20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited)]] (20240425) | ||
| + | ** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321) | ||
| + | === [[:Category:Merritt Funk|Merritt Funk of Austin TX (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240380114. Parallel Resonance Antenna for Radial Plasma Control (Tokyo Electron Limited)]] (20241114) | ||
| + | ** [[20240203713. IN-SITU DIAGNOSIS OF PLASMA SYSTEM (Tokyo Electron Limited)]] (20240620) | ||
| + | ** [[20240213005. System and Method for Plasma Processing (Tokyo Electron Limited)]] (20240627) | ||
| + | === [[:Category:Keren J. KANARIK|Keren J. KANARIK of Los Altos CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Lam Research Corporation|Lam Research Corporation]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620) | ||
| + | ** [[20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620) | ||
| + | ** [[20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240530) | ||
| + | === [[:Category:Samantha SiamHwa TAN|Samantha SiamHwa TAN of Newark CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Lam Research Corporation|Lam Research Corporation]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620) | ||
| + | ** [[20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620) | ||
| + | ** [[20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240530) | ||
| + | === [[:Category:Yang PAN|Yang PAN of Los Altos CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Lam Research Corporation|Lam Research Corporation]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620) | ||
| + | ** [[20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620) | ||
| + | ** [[20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240530) | ||
| + | === [[:Category:Jeffrey MARKS|Jeffrey MARKS of Saratoga CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Lam Research Corporation|Lam Research Corporation]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620) | ||
| + | ** [[20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620) | ||
| + | ** [[20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240530) | ||
| + | === [[:Category:Linying CUI|Linying CUI of Cupertino CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240194446. CHAMBER IMPEDANCE MANAGEMENT IN A PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240613) | ||
| + | ** [[20240153741. MULTI-SHAPE VOLTAGE PULSE TRAINS FOR UNIFORMITY AND ETCH PROFILE TUNING (Applied Materials, Inc.)]] (20240509) | ||
| + | ** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125) | ||
| + | === [[:Category:James ROGERS|James ROGERS of Los Gatos CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240194446. CHAMBER IMPEDANCE MANAGEMENT IN A PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240613) | ||
| + | ** [[20240153741. MULTI-SHAPE VOLTAGE PULSE TRAINS FOR UNIFORMITY AND ETCH PROFILE TUNING (Applied Materials, Inc.)]] (20240509) | ||
| + | ** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125) | ||
| + | === [[:Category:Rajinder DHINDSA|Rajinder DHINDSA of Pleasanton CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240153741. MULTI-SHAPE VOLTAGE PULSE TRAINS FOR UNIFORMITY AND ETCH PROFILE TUNING (Applied Materials, Inc.)]] (20240509) | ||
| + | ** [[20240321610. SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITOR (Applied Materials, Inc.)]] (20240926) | ||
| + | ** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125) | ||
| + | === [[:Category:Koki MUKAIYAMA|Koki MUKAIYAMA]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240213032. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240627) | ||
| + | ** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926) | ||
| + | ** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125) | ||
| + | === [[:Category:Shinji HIMORI|Shinji HIMORI]] === | ||
| + | * Number of Plasma Technology patents: 5 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240096608. PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240321) | ||
| + | ** [[20240068921. PARTICLE MONITORING SYSTEM, PARTICLE MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240229) | ||
| + | ** [[20240194459. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613) | ||
| + | === [[:Category:A N M Wasekul AZAD|A N M Wasekul AZAD of Santa Clara CA (US)]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240290578. RADIO FREQUENCY DIVERTER ASSEMBLY ENABLING ON-DEMAND DIFFERENT SPATIAL OUTPUTS (Applied Materials, Inc.)]] (20240829) | ||
| + | ** [[20240079212. SCANNING IMPEDANCE MEASUREMENT IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240307) | ||
| + | ** [[20240177968. SYSTEM AND METHODS FOR IMPLEMENTING A MICRO PULSING SCHEME USING DUAL INDEPENDENT PULSERS (Applied Materials, Inc.)]] (20240530) | ||
| + | === [[:Category:Atsushi TAKAHASHI|Atsushi TAKAHASHI]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240112918. PLASMA PROCESSING SYSTEM, PLASMA PROCESSING APPARATUS, AND ETCHING METHOD (Tokyo Electron Limited)]] (20240404) | ||
| + | ** [[20240112922. ETCHING METHOD AND PLASMA PROCESSING SYSTEM (Tokyo Electron Limited)]] (20240404) | ||
| + | ** [[20240153744. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509) | ||
| + | === [[:Category:Kazuki MOYAMA|Kazuki MOYAMA]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240213000. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240627) | ||
| + | ** [[20240194459. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613) | ||
| + | ** [[20240047184. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240208) | ||
| + | === [[:Category:Mitsunori Ohata|Mitsunori Ohata]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240339297. PLASMA PROCESSING SYSTEMS WITH MATCHING NETWORK AND METHODS (Tokyo Electron Limited)]] (20241010) | ||
| + | ** [[20240347317. Method and System for Plasma Processing (Tokyo Electron Limited)]] (20241017) | ||
| + | ** [[20240363310. Balanced RF Resonant Antenna System (Tokyo Electron Limited)]] (20241031) | ||
| + | === [[:Category:Gen TAMAMUSHI|Gen TAMAMUSHI]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240170258. PLASMA PROCESSING SYSTEM AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20240523) | ||
| + | ** [[20240222078. PLASMA PROCESSING APPARATUS, POWER SUPPLY SYSTEM, CONTROL METHOD, PROGRAM, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20240704) | ||
| + | ** [[20240153742. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509) | ||
| + | === [[:Category:Yoshihide KIHARA|Yoshihide KIHARA]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240203698. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240620) | ||
| + | ** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926) | ||
| + | ** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125) | ||
| + | === [[:Category:Hiroyuki MATSUURA|Hiroyuki MATSUURA]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240014013. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20240111) | ||
| + | ** [[20240018660. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20240118) | ||
| + | ** [[20240170265. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240523) | ||
| + | === [[:Category:Satoru KAWAKAMI|Satoru KAWAKAMI]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 2 patents | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240203692. PLASMA PROCESSING APPARATUS AND PLASMA CONTROL METHOD (Tokyo Electron Limited)]] (20240620) | ||
| + | ** [[20240038500. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240201) | ||
| + | ** [[20240331977. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20241003) | ||
| + | === [[:Category:Shota YOSHIMURA|Shota YOSHIMURA]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240212987. GAS SUPPLY SYSTEM, GAS CONTROL SYSTEM, PLASMA PROCESSING APPARATUS, AND GAS CONTROL METHOD (Tokyo Electron Limited)]] (20240627) | ||
| + | ** [[20240071727. SUBSTRATE PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240229) | ||
| + | ** [[20240071728. SUBSTRATE PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240229) | ||
| + | === [[:Category:Jianping Zhao|Jianping Zhao of Austin TX (US)]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240203706. ALD PROCESS WITH PLASMA TREATMENT (Tokyo Electron Limited)]] (20240620) | ||
| + | ** [[20240021410. Plasma Processing with Broadband RF Waveforms (Tokyo Electron Limited)]] (20240118) | ||
| + | ** [[20240170256. VHF Broadband Coaxial Adapter (Tokyo Electron Limited)]] (20240523) | ||
| + | === [[:Category:Qiang Wang|Qiang Wang of Austin TX (US)]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240339297. PLASMA PROCESSING SYSTEMS WITH MATCHING NETWORK AND METHODS (Tokyo Electron Limited)]] (20241010) | ||
| + | ** [[20240347317. Method and System for Plasma Processing (Tokyo Electron Limited)]] (20241017) | ||
| + | ** [[20240363310. Balanced RF Resonant Antenna System (Tokyo Electron Limited)]] (20241031) | ||
| + | === [[:Category:Shin YAMAGUCHI|Shin YAMAGUCHI]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240194457. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613) | ||
| + | ** [[20240194458. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613) | ||
| + | ** [[20240153749. STAGE AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509) | ||
| + | === [[:Category:Makoto KATO|Makoto KATO]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240194514. SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613) | ||
| + | ** [[20240087857. PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT (Tokyo Electron Limited)]] (20240314) | ||
| + | ** [[20240047182. PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK (Tokyo Electron Limited)]] (20240208) | ||
| + | === [[:Category:Hajime TAMURA|Hajime TAMURA]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240194457. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613) | ||
| + | ** [[20240194458. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613) | ||
| + | ** [[20240153749. STAGE AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509) | ||
| + | === [[:Category:Kazuya NAGASEKI|Kazuya NAGASEKI]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240096608. PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240321) | ||
| + | ** [[20240068921. PARTICLE MONITORING SYSTEM, PARTICLE MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240229) | ||
| + | ** [[20240194459. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613) | ||
| + | === [[:Category:Satoru TERUUCHI|Satoru TERUUCHI]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240096608. PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240321) | ||
| + | ** [[20240068921. PARTICLE MONITORING SYSTEM, PARTICLE MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240229) | ||
| + | ** [[20240194459. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613) | ||
| + | === [[:Category:Yasuharu SASAKI|Yasuharu SASAKI]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240194457. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613) | ||
| + | ** [[20240194458. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613) | ||
| + | ** [[20240153749. STAGE AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509) | ||
| + | === [[:Category:Naoki MATSUMOTO|Naoki MATSUMOTO]] === | ||
| + | * Number of Plasma Technology patents: 4 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240222075. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240704) | ||
| + | ** [[20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125) | ||
| + | ** [[20240030014. SEASONING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125) | ||
| + | === [[:Category:Da Song|Da Song of Albany NY (US)]] === | ||
| + | * Number of Plasma Technology patents: 3 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240230409. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240711) | ||
| + | ** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425) | ||
| + | ** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321) | ||
| + | === [[:Category:Shin MATSUURA|Shin MATSUURA]] === | ||
| + | * Number of Plasma Technology patents: 3 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents | ||
| + | ** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 1 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]] (20240711) | ||
| + | ** [[20240371609. PLASMA PROCESSING APPARATUS (TOKYO ELECTRON LIMITED)]] (20241107) | ||
| + | ** [[20240136158. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]] (20240425) | ||
| + | === [[:Category:Chelsea DuBose|Chelsea DuBose of Austin TX (US)]] === | ||
| + | * Number of Plasma Technology patents: 3 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240258074. Antenna Plane Magnets for Improved Performance (Tokyo Electron Limited)]] (20240801) | ||
| + | ** [[20240162619. Parallel Resonance Antenna for Radial Plasma Control (Tokyo Electron Limited)]] (20240516) | ||
| + | ** [[20240380114. Parallel Resonance Antenna for Radial Plasma Control (Tokyo Electron Limited)]] (20241114) | ||
| + | === [[:Category:Justin Moses|Justin Moses of Austin TX (US)]] === | ||
| + | * Number of Plasma Technology patents: 3 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240258074. Antenna Plane Magnets for Improved Performance (Tokyo Electron Limited)]] (20240801) | ||
| + | ** [[20240162619. Parallel Resonance Antenna for Radial Plasma Control (Tokyo Electron Limited)]] (20240516) | ||
| + | ** [[20240380114. Parallel Resonance Antenna for Radial Plasma Control (Tokyo Electron Limited)]] (20241114) | ||
| + | === [[:Category:Hiroyuki MIYASHITA|Hiroyuki MIYASHITA]] === | ||
| + | * Number of Plasma Technology patents: 3 | ||
| + | * Top companies: | ||
| + | ** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents | ||
| + | * Recent patents: | ||
| + | ** [[20240297018. DISTRIBUTOR AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240905) | ||
| + | ** [[20240297020. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240905) | ||
| + | ** [[20240212985. FILTER CIRCUIT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240627) | ||
| + | |||
| + | == Top Collaborations in Plasma Technology == | ||
| + | [[File:Top_20_Collaborations_in_Plasma_Technology.png|border|800px]] | ||
| + | |||
| + | == Top US States for Plasma Technology Inventors == | ||
| + | [[File:Top_10_US_States_for_Plasma_Technology_Inventors.png|border|800px]] | ||
| + | |||
| + | |||
| + | == Top Cities for Plasma Technology Inventors == | ||
| + | [[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]] | ||
| + | |||
| + | * Miyagi: 177 inventors | ||
| + | * Tokyo: 120 inventors | ||
| + | * Kurokawa-gun: 72 inventors | ||
| + | * Suwon-si: 63 inventors | ||
| + | * Austin: 51 inventors | ||
| + | * Fremont: 41 inventors | ||
| + | * Yamanashi: 41 inventors | ||
| + | * Albany: 40 inventors | ||
| + | * Santa Clara: 40 inventors | ||
| + | * San Jose: 40 inventors | ||
| + | * Seoul: 20 inventors | ||
| + | * Nirasaki City: 18 inventors | ||
| + | * Hsinchu: 16 inventors | ||
| + | * Sunnyvale: 14 inventors | ||
| + | * Pleasanton: 13 inventors | ||
| + | * Portland: 13 inventors | ||
| + | * Redwood City: 12 inventors | ||
| + | * Nirasaki City, Yamanashi: 11 inventors | ||
| + | * Shanghai: 11 inventors | ||
| + | * Saratoga: 10 inventors | ||
[[Category:Plasma Technology]] | [[Category:Plasma Technology]] | ||
[[Category:Patent Application Trends by Technology in 2024]] | [[Category:Patent Application Trends by Technology in 2024]] | ||
Revision as of 00:07, 12 December 2024
Contents
- 1 Plasma Technology Patent Application Filing Activity
- 2 Plasma Technology patent applications in 2024
- 3 Top Technology Areas in Plasma Technology
- 4 Top Companies in Plasma Technology
- 4.1 Tokyo Electron Limited
- 4.2 Applied Materials, Inc.
- 4.3 Lam Research Corporation
- 4.4 Hitachi High-Tech Corporation
- 4.5 TOKYO ELECTRON LIMITED
- 4.6 HITACHI HIGH-TECH CORPORATION
- 4.7 SAMSUNG ELECTRONICS CO., LTD.
- 4.8 DISCO CORPORATION
- 4.9 Advanced Energy Industries, Inc.
- 4.10 Beijing E-Town Semiconductor Technology Co., Ltd.
- 5 New Companies in Plasma Technology (Last Month)
- 6 Emerging Technology Areas in Plasma Technology
- 7 Top Companies in Emerging Plasma Technology Technologies
- 8 Top Inventors in Plasma Technology
- 8.1 Kartik RAMASWAMY of San Jose CA (US)
- 8.2 Yue GUO of Redwood City CA (US)
- 8.3 Taro IKEDA
- 8.4 Chishio KOSHIMIZU
- 8.5 Sergey Voronin of Albany NY (US)
- 8.6 Yang YANG of San Diego CA (US)
- 8.7 Kazushi KANEKO
- 8.8 Peter Lowell George Ventzek of Austin TX (US)
- 8.9 Masaki HIRAYAMA
- 8.10 Eiki KAMATA
- 8.11 Barton Lane of Austin TX (US)
- 8.12 Maju TOMURA
- 8.13 Blaze Messer of Albany NY (US)
- 8.14 Yan Chen of Fremont CA (US)
- 8.15 Joel Ng of Fremont CA (US)
- 8.16 Ashawaraya Shalini of Fremont CA (US)
- 8.17 Ying Zhu of Fremont CA (US)
- 8.18 Merritt Funk of Austin TX (US)
- 8.19 Keren J. KANARIK of Los Altos CA (US)
- 8.20 Samantha SiamHwa TAN of Newark CA (US)
- 8.21 Yang PAN of Los Altos CA (US)
- 8.22 Jeffrey MARKS of Saratoga CA (US)
- 8.23 Linying CUI of Cupertino CA (US)
- 8.24 James ROGERS of Los Gatos CA (US)
- 8.25 Rajinder DHINDSA of Pleasanton CA (US)
- 8.26 Koki MUKAIYAMA
- 8.27 Shinji HIMORI
- 8.28 A N M Wasekul AZAD of Santa Clara CA (US)
- 8.29 Atsushi TAKAHASHI
- 8.30 Kazuki MOYAMA
- 8.31 Mitsunori Ohata
- 8.32 Gen TAMAMUSHI
- 8.33 Yoshihide KIHARA
- 8.34 Hiroyuki MATSUURA
- 8.35 Satoru KAWAKAMI
- 8.36 Shota YOSHIMURA
- 8.37 Jianping Zhao of Austin TX (US)
- 8.38 Qiang Wang of Austin TX (US)
- 8.39 Shin YAMAGUCHI
- 8.40 Makoto KATO
- 8.41 Hajime TAMURA
- 8.42 Kazuya NAGASEKI
- 8.43 Satoru TERUUCHI
- 8.44 Yasuharu SASAKI
- 8.45 Naoki MATSUMOTO
- 8.46 Da Song of Albany NY (US)
- 8.47 Shin MATSUURA
- 8.48 Chelsea DuBose of Austin TX (US)
- 8.49 Justin Moses of Austin TX (US)
- 8.50 Hiroyuki MIYASHITA
- 9 Top Collaborations in Plasma Technology
- 10 Top US States for Plasma Technology Inventors
- 11 Top Cities for Plasma Technology Inventors
Plasma Technology Patent Application Filing Activity
Plasma Technology patent applications in 2024
Top Technology Areas in Plasma Technology
Top CPC Codes
- H01J2237/334 (No explanation available)
- Count: 78 patents
- Example: 20240234097. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
- H01J37/32715 (No explanation available)
- Count: 66 patents
- Example: 20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)
- H01J37/32449 (No explanation available)
- Count: 48 patents
- Example: 20240234113. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
- H01J37/32183 (No explanation available)
- Count: 45 patents
- Example: 20240234092. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
- H01J37/32568 (No explanation available)
- Count: 39 patents
- Example: 20240234104. MULTI-SECTIONAL PLASMA CONFINEMENT RING STRUCTURE (Lam Research Corporation)
- H01J37/3244 (No explanation available)
- H01J37/32091 (No explanation available)
- Count: 35 patents
- Example: 20240234087. PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS (Applied Materials, Inc.)
- H01J37/32724 (No explanation available)
- Count: 34 patents
- Example: 20240234099. FORMING METHOD OF COMPONENT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
- H01J37/32174 (No explanation available)
- Count: 33 patents
- Example: 20240258070. PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS (Applied Materials, Inc.)
- H01J37/32642 (No explanation available)
- Count: 31 patents
- Example: 20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)
Top Companies in Plasma Technology
Tokyo Electron Limited
- Number of Plasma Technology patents: 162
- Top CPC codes:
- H01J37/32715 (No explanation available): 39 patents
- H01J2237/334 (No explanation available): 38 patents
- H01J37/32449 (No explanation available): 28 patents
- Recent patents:
Applied Materials, Inc.
- Number of Plasma Technology patents: 36
- Top CPC codes:
- H01J37/32183 (No explanation available): 11 patents
- H01J37/32128 (No explanation available): 10 patents
- H01J2237/3341 (No explanation available): 8 patents
- Recent patents:
- 20240321610. SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITOR (Applied Materials, Inc.) (20240926)
- 20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.) (20240125)
- 20240047246. ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING CHAMBER (Applied Materials, Inc.) (20240208)
Lam Research Corporation
- Number of Plasma Technology patents: 21
- Top CPC codes:
- H01L21/67069 (No explanation available): 7 patents
- H01L21/6833 (No explanation available): 7 patents
- H01L21/67109 (No explanation available): 5 patents
- Recent patents:
- 20240363311. RF POWER COMPENSATION TO REDUCE DEPOSITION OR ETCH RATE CHANGES IN RESPONSE TO SUBSTRATE BULK RESISTIVITY VARIATIONS (Lam Research Corporation) (20241031)
- 20240218509. MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA (Lam Research Corporation) (20240704)
- 20240322781. Multiple-Output Radiofrequency Matching Module and Associated Methods (Lam Research Corporation) (20240926)
Hitachi High-Tech Corporation
- Number of Plasma Technology patents: 17
- Top CPC codes:
- H01J2237/334 (No explanation available): 4 patents
- H01J37/32174 (No explanation available): 3 patents
- H01J37/32715 (No explanation available): 3 patents
- Recent patents:
- 20240047181. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation) (20240208)
- 20240047239. PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation) (20240208)
- 20240047258. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation) (20240208)
TOKYO ELECTRON LIMITED
- Number of Plasma Technology patents: 14
- Top CPC codes:
- H01J2237/334 (No explanation available): 3 patents
- H01J37/32247 (No explanation available): 3 patents
- H01J37/32513 (No explanation available): 2 patents
- Recent patents:
- 20240331977. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED) (20241003)
- 20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED) (20240125)
- 20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED) (20240125)
HITACHI HIGH-TECH CORPORATION
- Number of Plasma Technology patents: 11
- Top CPC codes:
- H01J2237/334 (No explanation available): 6 patents
- H01J37/32449 (No explanation available): 3 patents
- H01J37/32972 (No explanation available): 3 patents
- Recent patents:
SAMSUNG ELECTRONICS CO., LTD.
- Number of Plasma Technology patents: 7
- Top CPC codes:
- H01J37/3244 (No explanation available): 3 patents
- H01J2237/334 (No explanation available): 3 patents
- H01J37/3211 (No explanation available): 2 patents
- Recent patents:
- 20240212992. PLASMA PROCESSING APPARATUS AND METHOD (SAMSUNG ELECTRONICS CO., LTD.) (20240627)
- 20240096649. SEMICONDUCTOR PROCESS SYSTEM AND GAS TREATMENT METHOD (SAMSUNG ELECTRONICS CO., LTD.) (20240321)
- 20240038536. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD (SAMSUNG ELECTRONICS CO., LTD.) (20240201)
DISCO CORPORATION
- Number of Plasma Technology patents: 7
- Top CPC codes:
- H01L21/304 (No explanation available): 3 patents
- H01L21/3065 (No explanation available): 3 patents
- H01L24/80 (No explanation available): 2 patents
- Recent patents:
Advanced Energy Industries, Inc.
- Number of Plasma Technology patents: 7
- Top CPC codes:
- H01J37/32174 (No explanation available): 2 patents
- H01J37/32935 (No explanation available): 2 patents
- H01L21/67069 (No explanation available): 2 patents
- Recent patents:
- 20240071721. SYSTEM, METHOD, AND APPARATUS FOR CONTROLLING ION ENERGY DISTRIBUTION IN PLASMA PROCESSING SYSTEMS (Advanced Energy Industries, Inc.) (20240229)
- 20240194452. BIAS SUPPLY WITH RESONANT SWITCHING (Advanced Energy Industries, Inc.) (20240613)
- 20240030001. BIAS SUPPLY WITH A SINGLE CONTROLLED SWITCH (Advanced Energy Industries, Inc.) (20240125)
Beijing E-Town Semiconductor Technology Co., Ltd.
- Number of Plasma Technology patents: 6
- Top CPC codes:
- H01J37/32119 (No explanation available): 3 patents
- H01J2237/334 (No explanation available): 2 patents
- H01L21/6833 (No explanation available): 2 patents
- Recent patents:
- 20240055242. Workpiece Processing Apparatus with Thermal Processing Systems (Beijing E-Town Semiconductor Technology Co., Ltd.) (20240215)
- 20240096680. ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.) (20240321)
- 20240071754. Enhanced Ignition in Inductively Coupled Plasmas For Workpiece Processing (Beijing E-Town Semiconductor Technology Co., Ltd.) (20240229)
New Companies in Plasma Technology (Last Month)
No new companies detected in the last month.
Emerging Technology Areas in Plasma Technology
- H01L21/67063 (No explanation available)
- Count: 1 patents
- Example: 20240047258. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)
- C23C4/04 (No explanation available)
- G03F7/70633 (No explanation available)
- Count: 1 patents
- Example: 20240030073. ETCH MONITORING AND PERFORMING (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- H01J2237/24578 (No explanation available)
- Count: 1 patents
- Example: 20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)
- G05B15/02 (No explanation available)
- Count: 1 patents
- Example: 20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)
- G01N25/72 (No explanation available)
- Count: 1 patents
- Example: 20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
- G01M3/002 (No explanation available)
- Count: 1 patents
- Example: 20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
- H01J2237/3342 (No explanation available)
- Count: 1 patents
- Example: 20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
- H05B6/62 (No explanation available)
- Count: 1 patents
- Example: 20240030009. PLASMA PROCESSING APPARATUS AND TEMPERATURE CONTROLLING METHOD (Tokyo Electron Limited)
- H05B6/54 (No explanation available)
- Count: 1 patents
- Example: 20240030009. PLASMA PROCESSING APPARATUS AND TEMPERATURE CONTROLLING METHOD (Tokyo Electron Limited)
Top Companies in Emerging Plasma Technology Technologies
- Tokyo Electron Limited: 5 patents
- TOKYO ELECTRON LIMITED: 2 patents
- Hitachi High-Tech Corporation: 1 patents
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.: 1 patents
- TOCALO Co., Ltd.: 1 patents
Top Inventors in Plasma Technology
Kartik RAMASWAMY of San Jose CA (US)
- Number of Plasma Technology patents: 13
- Top companies:
- Applied Materials, Inc.: 13 patents
- Recent patents:
- 20240194447. LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.) (20240613)
- 20240152114. RADIO FREQUENCY IMPEDANCE MATCHING NETWORK WITH FLEXIBLE TUNING ALGORITHMS (Applied Materials, Inc.) (20240509)
- 20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.) (20240125)
Yue GUO of Redwood City CA (US)
- Number of Plasma Technology patents: 11
- Top companies:
- Applied Materials, Inc.: 11 patents
- Recent patents:
- 20240194447. LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.) (20240613)
- 20240152114. RADIO FREQUENCY IMPEDANCE MATCHING NETWORK WITH FLEXIBLE TUNING ALGORITHMS (Applied Materials, Inc.) (20240509)
- 20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.) (20240125)
Taro IKEDA
- Number of Plasma Technology patents: 10
- Top companies:
- Tokyo Electron Limited: 8 patents
- TOKYO ELECTRON LIMITED: 2 patents
- Recent patents:
Chishio KOSHIMIZU
- Number of Plasma Technology patents: 10
- Top companies:
- Tokyo Electron Limited: 10 patents
- Recent patents:
Sergey Voronin of Albany NY (US)
- Number of Plasma Technology patents: 8
- Top companies:
- Tokyo Electron Limited: 8 patents
- Recent patents:
- 20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited) (20240321)
- 20240096600. Substrate Bombardment with Ions having Targeted Mass using Pulsed Bias Phase Control (Tokyo Electron Limited) (20240321)
- 20240331979. Apparatus and Methods for Plasma Processing (Tokyo Electron Limited) (20241003)
Yang YANG of San Diego CA (US)
- Number of Plasma Technology patents: 8
- Top companies:
- Applied Materials, Inc.: 8 patents
- Recent patents:
- 20240177969. SOLID-STATE SWITCH BASED HIGH-SPEED PULSER WITH PLASMA IEDF MODIFICATION CAPABILITY THROUGH MULTILEVEL OUTPUT FUNCTIONALITY (Applied Materials, Inc.) (20240530)
- 20240194447. LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.) (20240613)
- 20240152114. RADIO FREQUENCY IMPEDANCE MATCHING NETWORK WITH FLEXIBLE TUNING ALGORITHMS (Applied Materials, Inc.) (20240509)
Kazushi KANEKO
- Number of Plasma Technology patents: 8
- Top companies:
- Tokyo Electron Limited: 5 patents
- TOKYO ELECTRON LIMITED: 3 patents
- Recent patents:
- 20240203692. PLASMA PROCESSING APPARATUS AND PLASMA CONTROL METHOD (Tokyo Electron Limited) (20240620)
- 20240371603. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, PLASMA PROCESSING METHOD, ANALYSIS METHOD, AND STORAGE MEDIUM (Tokyo Electron Limited) (20241107)
- 20240136154. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited) (20240425)
Peter Lowell George Ventzek of Austin TX (US)
- Number of Plasma Technology patents: 8
- Top companies:
- Tokyo Electron Limited: 8 patents
- Recent patents:
Masaki HIRAYAMA
- Number of Plasma Technology patents: 7
- Top companies:
- Tokyo Electron Limited: 6 patents
- TOKYO ELECTRON LIMITED: 1 patents
- Recent patents:
Eiki KAMATA
- Number of Plasma Technology patents: 7
- Top companies:
- TOKYO ELECTRON LIMITED: 4 patents
- Tokyo Electron Limited: 3 patents
- Recent patents:
- 20240170260. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED) (20240523)
- 20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED) (20240125)
- 20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED) (20240125)
Barton Lane of Austin TX (US)
- Number of Plasma Technology patents: 6
- Top companies:
- Tokyo Electron Limited: 6 patents
- Recent patents:
Maju TOMURA
- Number of Plasma Technology patents: 6
- Top companies:
- Tokyo Electron Limited: 6 patents
- Recent patents:
Blaze Messer of Albany NY (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Tokyo Electron Limited: 5 patents
- Recent patents:
- 20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited) (20240425)
- 20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited) (20240425)
- 20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited) (20240321)
Yan Chen of Fremont CA (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Tokyo Electron Limited: 5 patents
- Recent patents:
- 20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited) (20240425)
- 20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited) (20240425)
- 20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited) (20240321)
Joel Ng of Fremont CA (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Tokyo Electron Limited: 5 patents
- Recent patents:
- 20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited) (20240425)
- 20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited) (20240425)
- 20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited) (20240321)
Ashawaraya Shalini of Fremont CA (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Tokyo Electron Limited: 5 patents
- Recent patents:
- 20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited) (20240425)
- 20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited) (20240425)
- 20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited) (20240321)
Ying Zhu of Fremont CA (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Tokyo Electron Limited: 5 patents
- Recent patents:
- 20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited) (20240425)
- 20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited) (20240425)
- 20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited) (20240321)
Merritt Funk of Austin TX (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Tokyo Electron Limited: 5 patents
- Recent patents:
Keren J. KANARIK of Los Altos CA (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Lam Research Corporation: 5 patents
- Recent patents:
- 20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240620)
- 20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240620)
- 20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240530)
Samantha SiamHwa TAN of Newark CA (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Lam Research Corporation: 5 patents
- Recent patents:
- 20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240620)
- 20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240620)
- 20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240530)
Yang PAN of Los Altos CA (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Lam Research Corporation: 5 patents
- Recent patents:
- 20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240620)
- 20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240620)
- 20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240530)
Jeffrey MARKS of Saratoga CA (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Lam Research Corporation: 5 patents
- Recent patents:
- 20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240620)
- 20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240620)
- 20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation) (20240530)
Linying CUI of Cupertino CA (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Applied Materials, Inc.: 5 patents
- Recent patents:
- 20240194446. CHAMBER IMPEDANCE MANAGEMENT IN A PROCESSING CHAMBER (Applied Materials, Inc.) (20240613)
- 20240153741. MULTI-SHAPE VOLTAGE PULSE TRAINS FOR UNIFORMITY AND ETCH PROFILE TUNING (Applied Materials, Inc.) (20240509)
- 20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.) (20240125)
James ROGERS of Los Gatos CA (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Applied Materials, Inc.: 5 patents
- Recent patents:
- 20240194446. CHAMBER IMPEDANCE MANAGEMENT IN A PROCESSING CHAMBER (Applied Materials, Inc.) (20240613)
- 20240153741. MULTI-SHAPE VOLTAGE PULSE TRAINS FOR UNIFORMITY AND ETCH PROFILE TUNING (Applied Materials, Inc.) (20240509)
- 20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.) (20240125)
Rajinder DHINDSA of Pleasanton CA (US)
- Number of Plasma Technology patents: 5
- Top companies:
- Applied Materials, Inc.: 5 patents
- Recent patents:
- 20240153741. MULTI-SHAPE VOLTAGE PULSE TRAINS FOR UNIFORMITY AND ETCH PROFILE TUNING (Applied Materials, Inc.) (20240509)
- 20240321610. SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITOR (Applied Materials, Inc.) (20240926)
- 20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.) (20240125)
Koki MUKAIYAMA
- Number of Plasma Technology patents: 5
- Top companies:
- Tokyo Electron Limited: 5 patents
- Recent patents:
Shinji HIMORI
- Number of Plasma Technology patents: 5
- Top companies:
- Tokyo Electron Limited: 5 patents
- Recent patents:
- 20240096608. PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited) (20240321)
- 20240068921. PARTICLE MONITORING SYSTEM, PARTICLE MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited) (20240229)
- 20240194459. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited) (20240613)
A N M Wasekul AZAD of Santa Clara CA (US)
- Number of Plasma Technology patents: 4
- Top companies:
- Applied Materials, Inc.: 4 patents
- Recent patents:
- 20240290578. RADIO FREQUENCY DIVERTER ASSEMBLY ENABLING ON-DEMAND DIFFERENT SPATIAL OUTPUTS (Applied Materials, Inc.) (20240829)
- 20240079212. SCANNING IMPEDANCE MEASUREMENT IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.) (20240307)
- 20240177968. SYSTEM AND METHODS FOR IMPLEMENTING A MICRO PULSING SCHEME USING DUAL INDEPENDENT PULSERS (Applied Materials, Inc.) (20240530)
Atsushi TAKAHASHI
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
- 20240112918. PLASMA PROCESSING SYSTEM, PLASMA PROCESSING APPARATUS, AND ETCHING METHOD (Tokyo Electron Limited) (20240404)
- 20240112922. ETCHING METHOD AND PLASMA PROCESSING SYSTEM (Tokyo Electron Limited) (20240404)
- 20240153744. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited) (20240509)
Kazuki MOYAMA
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
Mitsunori Ohata
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
Gen TAMAMUSHI
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
- 20240170258. PLASMA PROCESSING SYSTEM AND PLASMA PROCESSING METHOD (Tokyo Electron Limited) (20240523)
- 20240222078. PLASMA PROCESSING APPARATUS, POWER SUPPLY SYSTEM, CONTROL METHOD, PROGRAM, AND STORAGE MEDIUM (Tokyo Electron Limited) (20240704)
- 20240153742. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited) (20240509)
Yoshihide KIHARA
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
Hiroyuki MATSUURA
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
Satoru KAWAKAMI
- Number of Plasma Technology patents: 4
- Top companies:
- TOKYO ELECTRON LIMITED: 2 patents
- Tokyo Electron Limited: 2 patents
- Recent patents:
Shota YOSHIMURA
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
- 20240212987. GAS SUPPLY SYSTEM, GAS CONTROL SYSTEM, PLASMA PROCESSING APPARATUS, AND GAS CONTROL METHOD (Tokyo Electron Limited) (20240627)
- 20240071727. SUBSTRATE PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited) (20240229)
- 20240071728. SUBSTRATE PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited) (20240229)
Jianping Zhao of Austin TX (US)
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
Qiang Wang of Austin TX (US)
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
Shin YAMAGUCHI
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
Makoto KATO
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
- 20240194514. SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING APPARATUS (Tokyo Electron Limited) (20240613)
- 20240087857. PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT (Tokyo Electron Limited) (20240314)
- 20240047182. PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK (Tokyo Electron Limited) (20240208)
Hajime TAMURA
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
Kazuya NAGASEKI
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
- 20240096608. PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited) (20240321)
- 20240068921. PARTICLE MONITORING SYSTEM, PARTICLE MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited) (20240229)
- 20240194459. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited) (20240613)
Satoru TERUUCHI
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
- 20240096608. PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited) (20240321)
- 20240068921. PARTICLE MONITORING SYSTEM, PARTICLE MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited) (20240229)
- 20240194459. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited) (20240613)
Yasuharu SASAKI
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
Naoki MATSUMOTO
- Number of Plasma Technology patents: 4
- Top companies:
- Tokyo Electron Limited: 4 patents
- Recent patents:
Da Song of Albany NY (US)
- Number of Plasma Technology patents: 3
- Top companies:
- Tokyo Electron Limited: 3 patents
- Recent patents:
Shin MATSUURA
- Number of Plasma Technology patents: 3
- Top companies:
- Tokyo Electron Limited: 2 patents
- TOKYO ELECTRON LIMITED: 1 patents
- Recent patents:
Chelsea DuBose of Austin TX (US)
- Number of Plasma Technology patents: 3
- Top companies:
- Tokyo Electron Limited: 3 patents
- Recent patents:
Justin Moses of Austin TX (US)
- Number of Plasma Technology patents: 3
- Top companies:
- Tokyo Electron Limited: 3 patents
- Recent patents:
Hiroyuki MIYASHITA
- Number of Plasma Technology patents: 3
- Top companies:
- Tokyo Electron Limited: 3 patents
- Recent patents:
Top Collaborations in Plasma Technology
Top US States for Plasma Technology Inventors
Top Cities for Plasma Technology Inventors
- Miyagi: 177 inventors
- Tokyo: 120 inventors
- Kurokawa-gun: 72 inventors
- Suwon-si: 63 inventors
- Austin: 51 inventors
- Fremont: 41 inventors
- Yamanashi: 41 inventors
- Albany: 40 inventors
- Santa Clara: 40 inventors
- San Jose: 40 inventors
- Seoul: 20 inventors
- Nirasaki City: 18 inventors
- Hsinchu: 16 inventors
- Sunnyvale: 14 inventors
- Pleasanton: 13 inventors
- Portland: 13 inventors
- Redwood City: 12 inventors
- Nirasaki City, Yamanashi: 11 inventors
- Shanghai: 11 inventors
- Saratoga: 10 inventors
