View source for US Patent Application 18364588. Warm Wafer After Ion Cryo-Implantation simplified abstract

=Warm Wafer After Ion Cryo-Implantation=


==Organization Name==

[[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]


[[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]

==Inventor(s)==

[[:Category:Yu-Chang Lin of Hsinchu (TW)|Yu-Chang Lin of Hsinchu (TW)]][[Category:Yu-Chang Lin of Hsinchu (TW)]]

[[:Category:Tien-Shun Chang of New Taipei (TW)|Tien-Shun Chang of New Taipei (TW)]][[Category:Tien-Shun Chang of New Taipei (TW)]]

[[:Category:Chun-Feng Nieh of Hsinchu (TW)|Chun-Feng Nieh of Hsinchu (TW)]][[Category:Chun-Feng Nieh of Hsinchu (TW)]]

[[:Category:Huicheng Chang of Tainan (TW)|Huicheng Chang of Tainan (TW)]][[Category:Huicheng Chang of Tainan (TW)]]

[[:Category:Yee-Chia Yeo of Hsinchu (TW)|Yee-Chia Yeo of Hsinchu (TW)]][[Category:Yee-Chia Yeo of Hsinchu (TW)]]

==Warm Wafer After Ion Cryo-Implantation - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18364588 titled 'Warm Wafer After Ion Cryo-Implantation

==Simplified Explanation==

The abstract of the patent application describes a process for ion cryo-implantation, which involves heating an implanted wafer under a heavy vacuum and then transferring it to load locks held at a lesser vacuum.

* Ion cryo-implantation process is utilized in the described embodiments.
* The implanted wafer is heated during a post implantation stage.
* The heating process takes place under a heavy vacuum.
* Load locks are used to transfer the heated wafer.
* The load locks are held at a lesser vacuum than the heavy vacuum.
* The process aims to improve the efficiency and effectiveness of ion cryo-implantation.


==Original Abstract Submitted==

Embodiments of an ion cryo-implantation process utilize a post implantation heating stage to heat the implanted wafer while under the heavy vacuum used during cryo-implantation. The implanted wafer is then transferred to load locks which are held at a lesser vacuum than the heavy vacuum.



[[Category:H01L21/67]]
[[Category:H01L21/265]]