View source for US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract

=OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER=


==Organization Name==

[[Taiwan Semiconductor Manufacturing Company, Ltd.]]


==Inventor(s)==

[[Min-Feng Kao of Chiayi City (TW)]]

[[Dun-Nian Yaung of Taipei City (TW)]]

[[Hsing-Chih Lin of Tainan City (TW)]]

[[Jen-Cheng Liu of Hsin-Chu City (TW)]]

[[Yi-Shin Chu of Hsinchu City (TW)]]

[[Ping-Tzu Chen of Tainan City (TW)]]

==OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18355463 titled 'OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER

==Simplified Explanation==

- The patent application is about an integrated chip structure.
- The structure includes two vias (electrical connections) within a dielectric structure on a substrate.
- The first via is smaller in width than the second via and they are laterally separated by the dielectric structure.
- An interconnect wire makes contact with the second via and extends past its outermost sidewall.
- A through-substrate via (TSV) is positioned over the second via and extends through the substrate.
- The TSV has a smaller width than the second via.
- The second via's outermost sidewalls are located outside of the TSV.


==Original Abstract Submitted==

The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a first via disposed within a dielectric structure on a substrate, and a second via disposed within the dielectric structure and laterally separated from the first via by the dielectric structure. The first via has a first width that is smaller than a second width of the second via. An interconnect wire vertically contacts the second via and extends laterally past an outermost sidewall of the second via. A through-substrate via (TSV) is arranged over the second via and extends through the substrate. The TSV has a minimum width that is smaller than the second width of the second via. The second via has opposing outermost sidewalls that are laterally outside of the TSV.