US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract
Contents
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Min-Feng Kao of Chiayi City (TW)
Dun-Nian Yaung of Taipei City (TW)
Hsing-Chih Lin of Tainan City (TW)
Jen-Cheng Liu of Hsin-Chu City (TW)
Yi-Shin Chu of Hsinchu City (TW)
Ping-Tzu Chen of Tainan City (TW)
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18355463 titled 'OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
Simplified Explanation
- The patent application is about an integrated chip structure. - The structure includes two vias (electrical connections) within a dielectric structure on a substrate. - The first via is smaller in width than the second via and they are laterally separated by the dielectric structure. - An interconnect wire makes contact with the second via and extends past its outermost sidewall. - A through-substrate via (TSV) is positioned over the second via and extends through the substrate. - The TSV has a smaller width than the second via. - The second via's outermost sidewalls are located outside of the TSV.
Original Abstract Submitted
The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a first via disposed within a dielectric structure on a substrate, and a second via disposed within the dielectric structure and laterally separated from the first via by the dielectric structure. The first via has a first width that is smaller than a second width of the second via. An interconnect wire vertically contacts the second via and extends laterally past an outermost sidewall of the second via. A through-substrate via (TSV) is arranged over the second via and extends through the substrate. The TSV has a minimum width that is smaller than the second width of the second via. The second via has opposing outermost sidewalls that are laterally outside of the TSV.
