View source for US Patent Application 18186876. LASER PRESSURE HEAD MODULE AND LASER BONDING APPARATUS INCLUDING THE SAME simplified abstract

=LASER PRESSURE HEAD MODULE AND LASER BONDING APPARATUS INCLUDING THE SAME=


==Organization Name==

[[Samsung Display Co., Ltd.]]


==Inventor(s)==

[[Jong Hyup Kim of Yongin-si (KR)]]

[[Jin Pyung Lee of Yongin-si (KR)]]

[[Gil Jun Kim of Yongin-si (KR)]]

[[Yong Hwan Kim of Yongin-si (KR)]]

[[Min Ho Bae of Yongin-si (KR)]]

[[Hae Wook Yang of Yongin-si (KR)]]

==LASER PRESSURE HEAD MODULE AND LASER BONDING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18186876 titled 'LASER PRESSURE HEAD MODULE AND LASER BONDING APPARATUS INCLUDING THE SAME

==Simplified Explanation==

The abstract describes a laser pressure head module that includes a pressure member and a gas supply unit.
* The pressure member consists of a first and second light-transmitting member with a sealed space between them.
* The gas supply unit is responsible for supplying gas to the sealed space, creating a pressing force.
* The pressing force causes the second light-transmitting member to expand or move in an external direction.


==Original Abstract Submitted==

A laser pressure head module including: a pressure member including: a first light-transmitting member; a second light-transmitting member; and a sealed space between the first light-transmitting member and the second light-transmitting member; and a gas supply unit to supply gas to the sealed space to generate a pressing force. The second light-transmitting member is to be expanded or moved in an external direction by the pressing force.