View source for US Patent Application 17725428. 3-D STRUCTURED TWO-PHASE MICROFLUIDIC COOLING WITH NANO STRUCTURED BOILING ENHANCEMENT COATING simplified abstract

=3-D STRUCTURED TWO-PHASE MICROFLUIDIC COOLING WITH NANO STRUCTURED BOILING ENHANCEMENT COATING=


==Organization Name==

[[Microsoft Technology Licensing, LLC]]


==Inventor(s)==

[[Bharath Ramakrishnan of Bellevue WA (US)]]


[[Husam Atallah Alissa of Redmond WA (US)]]


[[Eric C. Peterson of Woodinville WA (US)]]


[[Christian L. Belady of Mercer Island WA (US)]]


[[Dennis Trieu of Calgary (CA)]]


[[Ioannis Manousakis of Redmond WA (US)]]


[[Nicholas Andrew Keehn of Kirkland WA (US)]]


[[Kathryn M. Oseen-senda of Seattle WA (US)]]


[[Douglas Patrick Kelley of Sammamish WA (US)]]


==3-D STRUCTURED TWO-PHASE MICROFLUIDIC COOLING WITH NANO STRUCTURED BOILING ENHANCEMENT COATING - A simplified explanation of the abstract==


*This abstract for appeared for US patent application  number 17725428 Titled '3-D STRUCTURED TWO-PHASE MICROFLUIDIC COOLING WITH NANO STRUCTURED BOILING ENHANCEMENT COATING'

==Simplified Explanation==

This abstract describes a processor that consists of two components connected together with a small space in between. This space contains a microfluidic volume, which is filled with a wicking heat spreader. The wicking heat spreader has a special surface feature that helps enhance boiling.


==Original Abstract Submitted==

A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.