US Patent Application 17725428. 3-D STRUCTURED TWO-PHASE MICROFLUIDIC COOLING WITH NANO STRUCTURED BOILING ENHANCEMENT COATING simplified abstract
Contents
3-D STRUCTURED TWO-PHASE MICROFLUIDIC COOLING WITH NANO STRUCTURED BOILING ENHANCEMENT COATING
Organization Name
Microsoft Technology Licensing, LLC
Inventor(s)
Bharath Ramakrishnan of Bellevue WA (US)
Husam Atallah Alissa of Redmond WA (US)
Eric C. Peterson of Woodinville WA (US)
Christian L. Belady of Mercer Island WA (US)
Ioannis Manousakis of Redmond WA (US)
Nicholas Andrew Keehn of Kirkland WA (US)
Kathryn M. Oseen-senda of Seattle WA (US)
Douglas Patrick Kelley of Sammamish WA (US)
3-D STRUCTURED TWO-PHASE MICROFLUIDIC COOLING WITH NANO STRUCTURED BOILING ENHANCEMENT COATING - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17725428 Titled '3-D STRUCTURED TWO-PHASE MICROFLUIDIC COOLING WITH NANO STRUCTURED BOILING ENHANCEMENT COATING'
Simplified Explanation
This abstract describes a processor that consists of two components connected together with a small space in between. This space contains a microfluidic volume, which is filled with a wicking heat spreader. The wicking heat spreader has a special surface feature that helps enhance boiling.
Original Abstract Submitted
A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.
