View source for Texas instruments incorporated (20250140624). PACKAGES WITH ISOLATED DIES

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=PACKAGES WITH ISOLATED DIES=


==Organization Name==

[[:Category:texas instruments incorporated|texas instruments incorporated]]


[[Category:texas instruments incorporated]]

==Inventor(s)==

[[:Category:Hau Nguyen of San Jose CA US|Hau Nguyen of San Jose CA US]][[Category:Hau Nguyen of San Jose CA US]]

[[:Category:Vivek Arora of San Jose CA US|Vivek Arora of San Jose CA US]][[Category:Vivek Arora of San Jose CA US]]

[[:Category:Patrick Francis Thompson of Allen TX US|Patrick Francis Thompson of Allen TX US]][[Category:Patrick Francis Thompson of Allen TX US]]

[[:Category:Masamitsu Matsuura of Beppu-Shi Oita-Ken JP|Masamitsu Matsuura of Beppu-Shi Oita-Ken JP]][[Category:Masamitsu Matsuura of Beppu-Shi Oita-Ken JP]]

[[:Category:Daiki Komatsu of Beppu-Shi Oita-Ken JP|Daiki Komatsu of Beppu-Shi Oita-Ken JP]][[Category:Daiki Komatsu of Beppu-Shi Oita-Ken JP]]

==PACKAGES WITH ISOLATED DIES==


This abstract first appeared for US patent application 20250140624 titled 'PACKAGES WITH ISOLATED DIES

==Original Abstract Submitted==

a wafer chip scale package (wcsp) comprises first and second dies in differing voltage domains and an isolation material between the first and second dies and contacting multiple surfaces of each of the first and second dies. the package also comprises a first resin material contacting multiple surfaces of the isolation material, with the isolation material between the resin material and the first and second dies. the package also comprises a fiberglass material contacting a surface of the resin material and a second resin material contacting a surface of the fiberglass material. the package also comprises first and second conductive structures coupled to the first and second dies, respectively. the package also includes a passivation material contacting the first and second dies and the first and second conductive structures.



[[Category:H01L23/31]]
[[Category:H01L21/56]]
[[Category:H01L21/78]]
[[Category:H01L23/00]]
[[Category:H01L23/29]]
[[Category:H01L25/065]]
[[Category:CPC_H01L23/3135]]