Texas instruments incorporated (20250140624). PACKAGES WITH ISOLATED DIES
PACKAGES WITH ISOLATED DIES
Organization Name
texas instruments incorporated
Inventor(s)
Patrick Francis Thompson of Allen TX US
Masamitsu Matsuura of Beppu-Shi Oita-Ken JP
Daiki Komatsu of Beppu-Shi Oita-Ken JP
PACKAGES WITH ISOLATED DIES
This abstract first appeared for US patent application 20250140624 titled 'PACKAGES WITH ISOLATED DIES
Original Abstract Submitted
a wafer chip scale package (wcsp) comprises first and second dies in differing voltage domains and an isolation material between the first and second dies and contacting multiple surfaces of each of the first and second dies. the package also comprises a first resin material contacting multiple surfaces of the isolation material, with the isolation material between the resin material and the first and second dies. the package also comprises a fiberglass material contacting a surface of the resin material and a second resin material contacting a surface of the fiberglass material. the package also comprises first and second conductive structures coupled to the first and second dies, respectively. the package also includes a passivation material contacting the first and second dies and the first and second conductive structures.