View source for Intel corporation (20250144857). MOLDING SYSTEM AND MOLDING METHOD

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=MOLDING SYSTEM AND MOLDING METHOD=


==Organization Name==

[[:Category:intel corporation|intel corporation]]


[[Category:intel corporation]]

==Inventor(s)==

[[:Category:Zhixin Xie of Chandler AZ US|Zhixin Xie of Chandler AZ US]][[Category:Zhixin Xie of Chandler AZ US]]

[[:Category:Yi Li of Chandler AZ US|Yi Li of Chandler AZ US]][[Category:Yi Li of Chandler AZ US]]

[[:Category:Jesse Jones of Chandler AZ US|Jesse Jones of Chandler AZ US]][[Category:Jesse Jones of Chandler AZ US]]

[[:Category:Gang Duan of Chandler AZ US|Gang Duan of Chandler AZ US]][[Category:Gang Duan of Chandler AZ US]]

[[:Category:Andrew Jimenez of Mesa AZ US|Andrew Jimenez of Mesa AZ US]][[Category:Andrew Jimenez of Mesa AZ US]]

[[:Category:Jung Kyu Han of Chandler AZ US|Jung Kyu Han of Chandler AZ US]][[Category:Jung Kyu Han of Chandler AZ US]]

[[:Category:Yekan Wang of Chandler AZ US|Yekan Wang of Chandler AZ US]][[Category:Yekan Wang of Chandler AZ US]]

==MOLDING SYSTEM AND MOLDING METHOD==


This abstract first appeared for US patent application 20250144857 titled 'MOLDING SYSTEM AND MOLDING METHOD

==Original Abstract Submitted==

various aspects may provide a molding system. the molding system may include a molding unit which includes a first mold panel and a second mold panel. the first mold panel and the second mold panel may include a mold cavity which surrounds a semiconductor workpiece along a side surface of the semiconductor workpiece, with the first mold panel and the second mold panel engaged with the semiconductor workpiece. various aspects may also provide a molding method which utilize the molding system.



[[Category:B29C45/14]]
[[Category:B29C45/26]]
[[Category:CPC_B29C45/14655]]