View source for Applied materials, inc. (20250125181). LOW TEMPERATURE ELECTROSTATIC CHUCK

=LOW TEMPERATURE ELECTROSTATIC CHUCK=


==Organization Name==

[[:Category:applied materials, inc.|applied materials, inc.]]


[[Category:applied materials, inc.]]

==Inventor(s)==

[[:Category:Vijay D. Parkhe of San Jose CA US|Vijay D. Parkhe of San Jose CA US]][[Category:Vijay D. Parkhe of San Jose CA US]]

[[:Category:Onkara Swamy Kora Siddaramaiah of Fremont CA US|Onkara Swamy Kora Siddaramaiah of Fremont CA US]][[Category:Onkara Swamy Kora Siddaramaiah of Fremont CA US]]

[[:Category:David Benjaminson of Campbell CA US|David Benjaminson of Campbell CA US]][[Category:David Benjaminson of Campbell CA US]]

[[:Category:Ryan Pakulski of Brentwood CA US|Ryan Pakulski of Brentwood CA US]][[Category:Ryan Pakulski of Brentwood CA US]]

[[:Category:Anh N. Nguyen of Milpitas CA US|Anh N. Nguyen of Milpitas CA US]][[Category:Anh N. Nguyen of Milpitas CA US]]

[[:Category:Son T. Nguyen of San Jose CA US|Son T. Nguyen of San Jose CA US]][[Category:Son T. Nguyen of San Jose CA US]]

[[:Category:Prashanth Rao of Karnataka State IN|Prashanth Rao of Karnataka State IN]][[Category:Prashanth Rao of Karnataka State IN]]

==LOW TEMPERATURE ELECTROSTATIC CHUCK==


This abstract first appeared for US patent application 20250125181 titled 'LOW TEMPERATURE ELECTROSTATIC CHUCK

==Original Abstract Submitted==

exemplary semiconductor processing chambers may include a chamber body. the chambers may include a showerhead positioned atop the body. the chambers may include an electrostatic chuck assembly disposed within the body. the assembly may include a puck that may include a first plate including an electrically insulating material and that defines a substrate support surface. the puck may include a multi-zone heating assembly thermally coupled with the first plate. the puck may include bipolar electrodes. the puck may include a second plate that defines cooling channels. the assembly may include an insulator beneath the second plate. the assembly may include a base plate beneath the insulator. the assembly may include a shaft that may include a heater rod coupled with the heating assembly. the shaft may include a cooling fluid lumen fluidly coupled with the cooling channels. the shaft may include a power rod electrically coupled with a bipolar electrode.



[[Category:H01L21/683]]
[[Category:H01L21/67]]
[[Category:CPC_H01L21/6833]]