Applied materials, inc. (20250125181). LOW TEMPERATURE ELECTROSTATIC CHUCK
LOW TEMPERATURE ELECTROSTATIC CHUCK
Organization Name
Inventor(s)
Vijay D. Parkhe of San Jose CA US
Onkara Swamy Kora Siddaramaiah of Fremont CA US
David Benjaminson of Campbell CA US
Ryan Pakulski of Brentwood CA US
Anh N. Nguyen of Milpitas CA US
Son T. Nguyen of San Jose CA US
Prashanth Rao of Karnataka State IN
LOW TEMPERATURE ELECTROSTATIC CHUCK
This abstract first appeared for US patent application 20250125181 titled 'LOW TEMPERATURE ELECTROSTATIC CHUCK
Original Abstract Submitted
exemplary semiconductor processing chambers may include a chamber body. the chambers may include a showerhead positioned atop the body. the chambers may include an electrostatic chuck assembly disposed within the body. the assembly may include a puck that may include a first plate including an electrically insulating material and that defines a substrate support surface. the puck may include a multi-zone heating assembly thermally coupled with the first plate. the puck may include bipolar electrodes. the puck may include a second plate that defines cooling channels. the assembly may include an insulator beneath the second plate. the assembly may include a base plate beneath the insulator. the assembly may include a shaft that may include a heater rod coupled with the heating assembly. the shaft may include a cooling fluid lumen fluidly coupled with the cooling channels. the shaft may include a power rod electrically coupled with a bipolar electrode.
- Applied materials, inc.
- Vijay D. Parkhe of San Jose CA US
- Onkara Swamy Kora Siddaramaiah of Fremont CA US
- David Benjaminson of Campbell CA US
- Ryan Pakulski of Brentwood CA US
- Anh N. Nguyen of Milpitas CA US
- Son T. Nguyen of San Jose CA US
- Prashanth Rao of Karnataka State IN
- H01L21/683
- H01L21/67
- CPC H01L21/6833