View source for Applied materials, inc. (20250115698). CURABLE FORMULATIONS FOR POLISHING PADS

=CURABLE FORMULATIONS FOR POLISHING PADS=


==Organization Name==

[[:Category:applied materials, inc.|applied materials, inc.]]


[[Category:applied materials, inc.]]

==Inventor(s)==

[[:Category:Xinyi Lu of Santa Clara CA US|Xinyi Lu of Santa Clara CA US]][[Category:Xinyi Lu of Santa Clara CA US]]

[[:Category:SeyedMahmoud Hosseini of San Jose CA US|SeyedMahmoud Hosseini of San Jose CA US]][[Category:SeyedMahmoud Hosseini of San Jose CA US]]

[[:Category:Sudhakar Madhusoodhanan of San Jose CA US|Sudhakar Madhusoodhanan of San Jose CA US]][[Category:Sudhakar Madhusoodhanan of San Jose CA US]]

[[:Category:Srikant Pathak of Diamond Bar CA US|Srikant Pathak of Diamond Bar CA US]][[Category:Srikant Pathak of Diamond Bar CA US]]

==CURABLE FORMULATIONS FOR POLISHING PADS==


This abstract first appeared for US patent application 20250115698 titled 'CURABLE FORMULATIONS FOR POLISHING PADS

==Original Abstract Submitted==

printable resin precursor compositions and polishing articles including printable resin precursors are provided. printable resin precursors include a curable precursor formulation having a viscosity of less than or about 15 cp at 70� which include at least one urethane acrylate oligomer, at least one reactive monomer, and a photoinitiator. the curable precursor formulation exhibits an ultimate tensile strength measured in mpa and an elongation at break (%), where a product of the ultimate tensile strength and the elongation at break is greater than or about 2,000.



[[Category:C08F222/10]]
[[Category:B24D18/00]]
[[Category:B33Y10/00]]
[[Category:B33Y70/00]]
[[Category:C08F2/50]]
[[Category:CPC_C08F222/1065]]