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Applied materials, inc. (20250115698). CURABLE FORMULATIONS FOR POLISHING PADS

From WikiPatents

CURABLE FORMULATIONS FOR POLISHING PADS

Organization Name

applied materials, inc.

Inventor(s)

Xinyi Lu of Santa Clara CA US

SeyedMahmoud Hosseini of San Jose CA US

Sudhakar Madhusoodhanan of San Jose CA US

Srikant Pathak of Diamond Bar CA US

CURABLE FORMULATIONS FOR POLISHING PADS

This abstract first appeared for US patent application 20250115698 titled 'CURABLE FORMULATIONS FOR POLISHING PADS

Original Abstract Submitted

printable resin precursor compositions and polishing articles including printable resin precursors are provided. printable resin precursors include a curable precursor formulation having a viscosity of less than or about 15 cp at 70� which include at least one urethane acrylate oligomer, at least one reactive monomer, and a photoinitiator. the curable precursor formulation exhibits an ultimate tensile strength measured in mpa and an elongation at break (%), where a product of the ultimate tensile strength and the elongation at break is greater than or about 2,000.

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