View source for Applied materials, inc. (20250085056). PROCESS CHAMBER SUBSTRATE TRANSFER

=PROCESS CHAMBER SUBSTRATE TRANSFER=


==Organization Name==

[[:Category:applied materials, inc.|applied materials, inc.]]


[[Category:applied materials, inc.]]

==Inventor(s)==

[[:Category:Wolfgang R. Aderhold of Cupertino CA (US)|Wolfgang R. Aderhold of Cupertino CA (US)]][[Category:Wolfgang R. Aderhold of Cupertino CA (US)]]

[[:Category:Peter Demonte of Millbrae CA (US)|Peter Demonte of Millbrae CA (US)]][[Category:Peter Demonte of Millbrae CA (US)]]

==PROCESS CHAMBER SUBSTRATE TRANSFER==


This abstract first appeared for US patent application 20250085056 titled 'PROCESS CHAMBER SUBSTRATE TRANSFER

==Original Abstract Submitted==

a processing system is provided including a first chamber and a second chamber. the first chamber includes: a chamber body enclosing an interior volume; an edge ring having a top and a bottom, the edge ring including a first ledge extending inwardly from the top and a second ledge extending inwardly relative to the first ledge. the first ledge is configured to support a substrate and the second ledge is configured to support a susceptor. the first chamber further includes a plurality of heating lamps positioned over the edge ring. the second chamber includes: a chamber body enclosing an interior volume; a first cooling plate; one or more robots in the interior volume of the second chamber, the one or more robots having one or more end effectors positioned over the first cooling plate; and a plurality of lift pins extending through the first cooling plate.



[[Category:F27D3/00]]
[[Category:CPC_F27D3/0084]]