Applied materials, inc. (20250085056). PROCESS CHAMBER SUBSTRATE TRANSFER
PROCESS CHAMBER SUBSTRATE TRANSFER
Organization Name
Inventor(s)
Wolfgang R. Aderhold of Cupertino CA (US)
Peter Demonte of Millbrae CA (US)
PROCESS CHAMBER SUBSTRATE TRANSFER
This abstract first appeared for US patent application 20250085056 titled 'PROCESS CHAMBER SUBSTRATE TRANSFER
Original Abstract Submitted
a processing system is provided including a first chamber and a second chamber. the first chamber includes: a chamber body enclosing an interior volume; an edge ring having a top and a bottom, the edge ring including a first ledge extending inwardly from the top and a second ledge extending inwardly relative to the first ledge. the first ledge is configured to support a substrate and the second ledge is configured to support a susceptor. the first chamber further includes a plurality of heating lamps positioned over the edge ring. the second chamber includes: a chamber body enclosing an interior volume; a first cooling plate; one or more robots in the interior volume of the second chamber, the one or more robots having one or more end effectors positioned over the first cooling plate; and a plurality of lift pins extending through the first cooling plate.
