View source for 20250232992. Deposition Apparatus Detection System Metho (TAIWAN SEMICONDUCTOR MANUFACTURING .)

= DEPOSITION APPARATUS WITH DETECTION SYSTEM AND METHODS =

'''Abstract''':
a method includes: flowing a process gas into a chamber of a furnace; forming a material layer on a wafer via the process gas; flowing a purge gas into the chamber; exhausting the purge gas and particles from the chamber via an exhaust line; detecting the particles in the exhaust line; determining whether a particle parameter associated with the particles exceeds a threshold value; and in response to the particle parameter exceeding the threshold value, adjusting flow of the purge gas into the chamber.

'''Inventor(s)''': [[:Category:Ming-Yao HSIAO of Hsinchu  TW|Ming-Yao HSIAO]], [[:Category:Yu-Sen CHU of Hsinchu  TW|Yu-Sen CHU]]

'''CPC Classification''': [[:Category:CPC_H01L21/67253|H01L21/67253]] (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere  (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})


[[Category:Patent Applications]]
[[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.]]
[[Category:CPC_H01L21/67253]]
[[Category:Ming-Yao HSIAO of Hsinchu  TW]]
[[Category:Yu-Sen CHU of Hsinchu  TW]]

[https://wikipatents.org/index.php?search=20250232992+rejection&title=Special%3ASearch&wprov=acrw1_-1 Search for rejections for patent application number 20250232992]


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