View source for 20250231432. Optically Bridged Multicompo (Celestial AI .)

= Optically Bridged Multicomponent Package with Extended Temperature Range =

'''Abstract''':
a package comprises a photonic integrated circuit (pic) with a modulator having a first modulator input, and a pic interconnect region within two millimeters or fifty microns from the modulator. additionally, an electric integrated circuit (eic) is included with a driver circuit and an eic interconnect region within two millimeters or fifty microns from the driver circuit. the driver circuit is electrically connected to the first modulator input via the eic interconnect region, a first metal interconnect, and the pic interconnect region. the modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.

'''Inventor(s)''': [[:Category:Philip WINTERBOTTOM of San Jose CA US|Philip WINTERBOTTOM]], [[:Category:David LAZOVSKY of Los Gatos CA US|David LAZOVSKY]], [[:Category:Ankur AGGARWAL of Pleasanton CA US|Ankur AGGARWAL]], [[:Category:Martinus BOS of San Jose CA US|Martinus BOS]], [[:Category:Subal Sahni of La Jolla CA US|Subal Sahni]]

'''CPC Classification''': [[:Category:CPC_G02F1/0123|G02F1/0123]] (for the control of the intensity, phase, polarisation or colour   (,  take precedence))


[[Category:Patent Applications]]
[[Category:Celestial AI Inc.]]
[[Category:CPC_G02F1/0123]]
[[Category:Philip WINTERBOTTOM of San Jose CA US]]
[[Category:David LAZOVSKY of Los Gatos CA US]]
[[Category:Ankur AGGARWAL of Pleasanton CA US]]
[[Category:Martinus BOS of San Jose CA US]]
[[Category:Subal Sahni of La Jolla CA US]]

[https://wikipatents.org/index.php?search=20250231432+rejection&title=Special%3ASearch&wprov=acrw1_-1 Search for rejections for patent application number 20250231432]


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