Optically Bridged Multicomponent Package with Extended Temperature Range

Abstract: a package comprises a photonic integrated circuit (pic) with a modulator having a first modulator input, and a pic interconnect region within two millimeters or fifty microns from the modulator. additionally, an electric integrated circuit (eic) is included with a driver circuit and an eic interconnect region within two millimeters or fifty microns from the driver circuit. the driver circuit is electrically connected to the first modulator input via the eic interconnect region, a first metal interconnect, and the pic interconnect region. the modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.

Inventor(s): Philip WINTERBOTTOM, David LAZOVSKY, Ankur AGGARWAL, Martinus BOS, Subal Sahni

CPC Classification: G02F1/0123 (for the control of the intensity, phase, polarisation or colour (, take precedence))

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