View source for 20250230345. Composition Chemical-m (FUJIMI INCORPORATED)

= COMPOSITION FOR CHEMICAL-MECHANICAL POLISHING AND METHOD FOR USING COMPOSITION =

'''Abstract''':
the present disclosure relates to chemical mechanical polishing (cmp) compositions for polishing molybdenum surfaces.

'''Inventor(s)''': [[:Category:Shogo ONISHI of Aichi  JP|Shogo ONISHI]]

'''CPC Classification''': [[:Category:CPC_C09K3/1463|C09K3/1463]] (Anti-slip materials; Abrasives {(products specifically intended for the fabrication of abrasive tools, blocks or papers, or for operations of the kind of sand-blasting and barrelling , ; polishing compositions containing abrasive or grinding agents ; polishing of semi-conductors ; friction compositions for brakes or clutches )})


[[Category:Patent Applications]]
[[Category:FUJIMI INCORPORATED]]
[[Category:CPC_C09K3/1463]]
[[Category:Shogo ONISHI of Aichi  JP]]

[https://wikipatents.org/index.php?search=20250230345+rejection&title=Special%3ASearch&wprov=acrw1_-1 Search for rejections for patent application number 20250230345]


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