View source for 20250218776. Method Forming Se (Winbond Electronics .)

= METHOD OF FORMING SEMICONDUCTOR STRUCTURE =

'''Abstract''':
a method of forming a semiconductor structure is provided. the method includes following steps. a core pattern is formed on a target layer. spacers are formed on sidewalls of the core pattern. the core pattern is removed to form an opening between the spacers. a portion of the target layer is removed by using the spacers as a mask to form a plurality of pairs of target patterns. after forming the pairs of target patterns, the spacers are removed, wherein a core opening is formed between each of pair of target patterns, and a gap opening is formed between adjacent pairs of the target patterns. a core capacitance value of corresponding target patterns on both sides of the core opening or a gap capacitance value of corresponding target patterns on both sides of the gap opening is measured to detect a structural uniformity of the core pattern.

'''Inventor(s)''': [[:Category:Pei-Hsiu Peng of Taichung City  TW|Pei-Hsiu Peng]], [[:Category:Hung-Yu Wei of Taichung City  TW|Hung-Yu Wei]]

'''CPC Classification''': [[:Category:CPC_H01L21/0338|H01L21/0338]] ({Process specially adapted to improve the resolution of the mask})


[[Category:Patent Applications]]
[[Category:Winbond Electronics Corp.]]
[[Category:CPC_H01L21/0338]]
[[Category:Pei-Hsiu Peng of Taichung City  TW]]
[[Category:Hung-Yu Wei of Taichung City  TW]]

[https://wikipatents.org/index.php?search=20250218776+rejection&title=Special%3ASearch&wprov=acrw1_-1 Search for rejections for patent application number 20250218776]


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