View source for 20250196288. Method Releasing Substra (EBARA)

= METHOD FOR RELEASING SUBSTRATE, METHOD FOR POLISHING SUBSTRATE, SUBSTRATE POLISHING APPARATUS, SUBSTRATE PROCESSING APPARATUS, CONTROL APPARATUS, CONTROL METHOD, AND CONTROL PROGRAM =

'''Abstract''':
provided is a method for releasing a substrate adsorbed to a first surface of an elastic film included in a substrate holding apparatus of a substrate polishing apparatus,



'''Inventor(s)''': [[:Category:Osamu NABEYA of Tokyo  JP|Osamu NABEYA]], [[:Category:Yuichi KATO of Tokyo  JP|Yuichi KATO]]

'''CPC Classification''': [[:Category:CPC_B24B37/345|B24B37/345]] ({Feeding, loading or unloading work specially adapted to lapping})


[[Category:Patent Applications]]
[[Category:EBARA CORPORATION]]
[[Category:CPC_B24B37/345]]
[[Category:Osamu NABEYA of Tokyo  JP]]
[[Category:Yuichi KATO of Tokyo  JP]]

[https://wikipatents.org/index.php?search=20250196288+rejection&title=Special%3ASearch&wprov=acrw1_-1 Search for rejections for patent application number 20250196288]


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