METHOD FOR RELEASING SUBSTRATE, METHOD FOR POLISHING SUBSTRATE, SUBSTRATE POLISHING APPARATUS, SUBSTRATE PROCESSING APPARATUS, CONTROL APPARATUS, CONTROL METHOD, AND CONTROL PROGRAM

Abstract: provided is a method for releasing a substrate adsorbed to a first surface of an elastic film included in a substrate holding apparatus of a substrate polishing apparatus,

Inventor(s): Osamu NABEYA, Yuichi KATO

CPC Classification: B24B37/345 ({Feeding, loading or unloading work specially adapted to lapping})

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