View source for 20250167114. Semiconductor Device Me (KIOXIA)

= SEMICONDUCTOR DEVICE AND MEMORY SYSTEM =

'''Abstract''':
according to one embodiment, a semiconductor device includes a first substrate; a semiconductor chip provided in a first region of a first face of the first substrate; and a first structure provided in a second region of the first face, wherein the first substrate includes: wiring embedded in the first substrate; a first conductor coupled to the semiconductor chip and the wiring and exposed on the first face; and a second conductor coupled to the first conductor via the wiring and exposed on a second face of the first substrate, a height of the first structure in a first direction perpendicular to the first face is greater than a height of the semiconductor chip in the first direction, in a case where the first face is taken as a reference.

'''Inventor(s)''': [[:Category:Yuta TSUBOUCHI of Tokyo  JP|Yuta TSUBOUCHI]]

'''CPC Classification''': [[:Category:CPC_H01L23/5283|H01L23/5283]] ({Geometry or} layout of the interconnection structure {( takes precedence; algorithms )})


[[Category:Patent Applications]]
[[Category:KIOXIA CORPORATION]]
[[Category:CPC_H01L23/5283]]
[[Category:Yuta TSUBOUCHI of Tokyo  JP]]

[https://wikipatents.org/index.php?search=20250167114+rejection&title=Special%3ASearch&wprov=acrw1_-1 Search for rejections for patent application number 20250167114]


<!-- JSON-LD markup for search engines:
{"@context":"https://schema.org","@type":"TechArticle","headline":"20250167114. Semiconductor Device Me (KIOXIA)","name":"20250167114. Semiconductor Device Me (KIOXIA)","description":"Patent application abstract and classification for 20250167114 - Semiconductor Device And Me","datePublished":"2025-05-25","mainEntity":{"@type":"GovernmentPermit","permitType":"Patent Application","identifier":"20250167114","name":"Semiconductor Device And Me","additionalProperty":[{"@type":"PropertyValue","name":"Organization","value":"KIOXIA CORPORATION"}]}}
-->