View source for 20240085891.VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS simplified abstract (samsung electronics co., ltd.)

=VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS=


==Organization Name==

[[:Category:samsung electronics co., ltd.|samsung electronics co., ltd.]]


[[Category:samsung electronics co., ltd.]]

==Inventor(s)==

[[:Category:Jaehyun Choi of Suwon-si (KR)|Jaehyun Choi of Suwon-si (KR)]][[Category:Jaehyun Choi of Suwon-si (KR)]]

==VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240085891 titled 'VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS

==Simplified Explanation==

The abstract describes a virtual metrology method for predicting the physical characteristics of a target wafer based on the process path information and measured values of sample wafers.

* Collect log data with process path information of manufactured wafers.
* Measure physical characteristics of sample wafers.
* Classify measured values of sample wafers based on process paths.
* Calculate moving average values for each process path.
* Determine moving average value for the target wafer as a predicted value.

== Potential Applications ==
This technology can be applied in semiconductor manufacturing processes to predict the physical characteristics of wafers without the need for direct measurement.

== Problems Solved ==
1. Eliminates the need for direct measurement of target wafers, saving time and resources.
2. Provides accurate predictions of physical characteristics based on historical data and process paths.

== Benefits ==
1. Improved efficiency in wafer manufacturing processes.
2. Enhanced quality control through predictive analysis.
3. Cost savings by reducing the need for physical measurements.

== Potential Commercial Applications ==
Predictive metrology technology can be utilized in semiconductor manufacturing companies to optimize production processes and ensure consistent quality of wafers.

== Possible Prior Art ==
One possible prior art could be traditional metrology methods that rely on direct measurements of physical characteristics of wafers, which may be time-consuming and costly.

=== Unanswered Questions ===

=== How does this technology impact the overall yield of semiconductor manufacturing processes? ===
This technology can potentially increase the yield by providing accurate predictions of physical characteristics, allowing for timely adjustments in the manufacturing process to avoid defects.

=== What are the limitations of virtual metrology compared to traditional direct measurement methods? ===
Virtual metrology may have limitations in predicting certain complex physical characteristics that require direct measurement techniques for accurate results.


==Original Abstract Submitted==

a virtual metrology method for a wafer includes collecting log data including process path information of wafers manufactured in a semiconductor process; collecting measured values of sample wafers of which physical characteristics are measured in the semiconductor process, the sample wafers being a group of wafers selected from among the manufactured wafers; classifying measured values of the sample wafers according to process paths based on the process path information; calculating a moving average value of measured values classified for each process path; and determining a moving average value corresponding to a process path of an unmeasured target wafer from among the manufactured wafers as a predicted value of the physical characteristics of the target wafer.



[[Category:G05B19/418]]