View source for 20240047317. PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES simplified abstract (Littelfuse Semiconductor (Wuxi) Co., Ltd.)

=PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES=


==Organization Name==

[[:Category:Littelfuse Semiconductor (Wuxi) Co., Ltd.|Littelfuse Semiconductor (Wuxi) Co., Ltd.]]


[[Category:Littelfuse Semiconductor (Wuxi) Co., Ltd.]]

==Inventor(s)==

[[:Category:Lucas Zhang of Wuxi (CN)|Lucas Zhang of Wuxi (CN)]][[Category:Lucas Zhang of Wuxi (CN)]]

[[:Category:Chao Gao of Wuxi (CN)|Chao Gao of Wuxi (CN)]][[Category:Chao Gao of Wuxi (CN)]]

[[:Category:Glenda Zhang of Wuxi (CN)|Glenda Zhang of Wuxi (CN)]][[Category:Glenda Zhang of Wuxi (CN)]]

==PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240047317 titled 'PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES

==Simplified Explanation==

The abstract of this patent application describes a package structure that includes a lead frame with a pedestal and a lead, a chip layer, and a clip with a pedestal and a lead connector. The first lead frame has a recessed area with a die pad, and the chip layer is in abutment with the first lead frame's perimeter ridge. The clip has a second recessed area defined by a perimeter ridge, which is in abutment with the first main side of the chip layer.

* The package structure includes a lead frame with a pedestal and a lead, providing a structure for mounting electronic components.
* A chip layer is included, which is in contact with the first lead frame's perimeter ridge, allowing for secure attachment and electrical connection.
* The clip has a second pedestal and a lead connector, providing additional support and connectivity.
* The second pedestal of the clip has a recessed area defined by a perimeter ridge, allowing for the placement of electronic components.
* The second perimeter ridge of the clip is in abutment with the first main side of the chip layer, ensuring proper alignment and connection.

Potential applications of this technology:

* Electronics packaging: This package structure can be used in various electronic devices, such as smartphones, computers, and automotive electronics, to provide a secure and reliable connection for electronic components.
* Semiconductor industry: The package structure can be utilized in the semiconductor industry for the packaging of integrated circuits and other semiconductor devices.

Problems solved by this technology:

* Secure mounting: The package structure provides a secure mounting platform for electronic components, preventing movement or detachment during operation.
* Electrical connectivity: The design ensures proper electrical connectivity between the components, minimizing signal loss or interference.
* Alignment and positioning: The abutment of the chip layer and the clip's perimeter ridge ensures accurate alignment and positioning of the components, improving overall performance and reliability.

Benefits of this technology:

* Enhanced reliability: The package structure offers a robust and stable platform for electronic components, reducing the risk of failure or damage.
* Improved electrical performance: The secure connection and proper alignment contribute to improved electrical performance, ensuring efficient signal transmission.
* Simplified assembly process: The design of the package structure simplifies the assembly process, reducing manufacturing time and costs.


==Original Abstract Submitted==

provided herein are package structures including a first lead frame having a first pedestal and a first lead extending from the first pedestal. a first perimeter ridge defines a first recessed area in a first main side of the first pedestal, wherein a die pad is positioned within the first recessed area. the package structure may further include a chip layer having a first main side opposite a second main side, wherein the second main side is in abutment with the first perimeter ridge of the pedestal of the first lead frame. the package structure may further include a clip including a second pedestal and a lead connector extending from the second pedestal, wherein a second perimeter ridge defines a second recessed area in a second main side of the second pedestal, and wherein the second perimeter ridge is in abutment with the first main side of the chip layer.



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