View source for 20240032204. METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM simplified abstract (Tong Hsing Electronic Industries, Ltd.)

=METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM=


==Organization Name==

[[:Category:Tong Hsing Electronic Industries, Ltd.|Tong Hsing Electronic Industries, Ltd.]]


[[Category:Tong Hsing Electronic Industries, Ltd.]]

==Inventor(s)==

[[:Category:Yueh-Kai Tang of Taipei City (TW)|Yueh-Kai Tang of Taipei City (TW)]][[Category:Yueh-Kai Tang of Taipei City (TW)]]

[[:Category:Chia-Shuai Chang of Taipei City (TW)|Chia-Shuai Chang of Taipei City (TW)]][[Category:Chia-Shuai Chang of Taipei City (TW)]]

[[:Category:Ming-Yen Pan of Taipei City (TW)|Ming-Yen Pan of Taipei City (TW)]][[Category:Ming-Yen Pan of Taipei City (TW)]]

[[:Category:Jian-Yu Shih of Taipei City (TW)|Jian-Yu Shih of Taipei City (TW)]][[Category:Jian-Yu Shih of Taipei City (TW)]]

[[:Category:Jhih-Wei Lai of Taipei City (TW)|Jhih-Wei Lai of Taipei City (TW)]][[Category:Jhih-Wei Lai of Taipei City (TW)]]

[[:Category:Shih-Han Wu of Taipei City (TW)|Shih-Han Wu of Taipei City (TW)]][[Category:Shih-Han Wu of Taipei City (TW)]]

==METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240032204 titled 'METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM

==Simplified Explanation==

The abstract of the patent application describes a method for manufacturing a conductive circuit board. The method involves the following steps:

(a) Preparing a substrate with opposite upper and lower surfaces and at least one through hole that extends through both surfaces, defined by an inner surface.
(b) Forming a metal base layer on at least one of the upper and lower surfaces and on the inner surface.
(c) Etching the metal base layer using a laser beam to create a patterned metal base layer on the upper and lower surfaces and the inner surface.
(d) Forming a metal circuit layer on the upper and lower surfaces and the inner surface to increase the thickness of the patterned metal base layer.

Bullet points explaining the patent/innovation:

* The method involves preparing a substrate with through holes and forming a metal base layer on the surfaces and inner surface of the substrate.
* The metal base layer is then etched using a laser beam to create a patterned metal base layer.
* A metal circuit layer is formed on the surfaces and inner surface to increase the thickness of the patterned metal base layer.

Potential applications of this technology:

* Manufacturing of conductive circuit boards for electronic devices.
* Integration into various electronic systems and devices that require reliable and efficient circuitry.

Problems solved by this technology:

* Provides a method for manufacturing conductive circuit boards with precise patterns and increased thickness.
* Enables the creation of complex circuitry on a substrate with through holes.

Benefits of this technology:

* Improved reliability and performance of circuit boards due to precise patterning and increased thickness.
* Enhanced efficiency in electronic systems and devices.
* Cost-effective manufacturing process.


==Original Abstract Submitted==

a method for manufacturing a conductive circuit board includes the steps of: (a) preparing a substrate having opposite upper and lower surfaces, and at least one through hole extending through the upper and lower surfaces and defined by an inner surface; (b) forming a metal base layer on at least one of the upper and lower surfaces and on the inner surface; (c) etching the metal base layer by a laser beam so that the at least one of the upper and lower surfaces and the inner surface are formed with a patterned metal base layer; and (d) forming a metal circuit layer on the at least one of the upper and lower surfaces and on the inner surface to increase a thickness of the patterned metal base layer. a conductive circuit board manufactured therefrom is also enclosed.



[[Category:H05K3/06]]
[[Category:H05K3/42]]
[[Category:H05K1/03]]