20240032204. METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM simplified abstract (Tong Hsing Electronic Industries, Ltd.)

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METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM

Organization Name

Tong Hsing Electronic Industries, Ltd.

Inventor(s)

Yueh-Kai Tang of Taipei City (TW)

Chia-Shuai Chang of Taipei City (TW)

Ming-Yen Pan of Taipei City (TW)

Jian-Yu Shih of Taipei City (TW)

Jhih-Wei Lai of Taipei City (TW)

Shih-Han Wu of Taipei City (TW)

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240032204 titled 'METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM

Simplified Explanation

The abstract of the patent application describes a method for manufacturing a conductive circuit board. The method involves the following steps:

(a) Preparing a substrate with opposite upper and lower surfaces and at least one through hole that extends through both surfaces, defined by an inner surface. (b) Forming a metal base layer on at least one of the upper and lower surfaces and on the inner surface. (c) Etching the metal base layer using a laser beam to create a patterned metal base layer on the upper and lower surfaces and the inner surface. (d) Forming a metal circuit layer on the upper and lower surfaces and the inner surface to increase the thickness of the patterned metal base layer.

Bullet points explaining the patent/innovation:

  • The method involves preparing a substrate with through holes and forming a metal base layer on the surfaces and inner surface of the substrate.
  • The metal base layer is then etched using a laser beam to create a patterned metal base layer.
  • A metal circuit layer is formed on the surfaces and inner surface to increase the thickness of the patterned metal base layer.

Potential applications of this technology:

  • Manufacturing of conductive circuit boards for electronic devices.
  • Integration into various electronic systems and devices that require reliable and efficient circuitry.

Problems solved by this technology:

  • Provides a method for manufacturing conductive circuit boards with precise patterns and increased thickness.
  • Enables the creation of complex circuitry on a substrate with through holes.

Benefits of this technology:

  • Improved reliability and performance of circuit boards due to precise patterning and increased thickness.
  • Enhanced efficiency in electronic systems and devices.
  • Cost-effective manufacturing process.


Original Abstract Submitted

a method for manufacturing a conductive circuit board includes the steps of: (a) preparing a substrate having opposite upper and lower surfaces, and at least one through hole extending through the upper and lower surfaces and defined by an inner surface; (b) forming a metal base layer on at least one of the upper and lower surfaces and on the inner surface; (c) etching the metal base layer by a laser beam so that the at least one of the upper and lower surfaces and the inner surface are formed with a patterned metal base layer; and (d) forming a metal circuit layer on the at least one of the upper and lower surfaces and on the inner surface to increase a thickness of the patterned metal base layer. a conductive circuit board manufactured therefrom is also enclosed.

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