View source for 18981790. COPPER ALLOY JOINED BODY (NGK INSULATORS, LTD.)

=COPPER ALLOY JOINED BODY=


==Organization Name==

[[:Category:NGK INSULATORS, LTD.|NGK INSULATORS, LTD.]]


[[Category:NGK INSULATORS, LTD.]]

==Inventor(s)==

[[:Category:Masaaki Akaiwa of Chita-Gun JP|Masaaki Akaiwa of Chita-Gun JP]][[Category:Masaaki Akaiwa of Chita-Gun JP]]

[[:Category:Takahiro Ishikawa of Toyoake-Shi JP|Takahiro Ishikawa of Toyoake-Shi JP]][[Category:Takahiro Ishikawa of Toyoake-Shi JP]]

[[:Category:Kazuhiro Nomura of Handa-Shi JP|Kazuhiro Nomura of Handa-Shi JP]][[Category:Kazuhiro Nomura of Handa-Shi JP]]

==COPPER ALLOY JOINED BODY==


This abstract first appeared for US patent application 18981790 titled 'COPPER ALLOY JOINED BODY

==Original Abstract Submitted==

There is provided a copper alloy bonded body composed of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another, wherein a bonding interface between the members remains. In the bonded body, the content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and, in a laser microscope image of a section including the bonding interface, a ratio of a total length of a line segment corresponding to a discontinuous region relative to an entire length of a bonding interface line defined along the bonding interface and a position where the bonding interface was present is 3.5% or more. The discontinuous region is defined as a region where, when a plurality of perpendicular lines is drawn with respect to the bonding interface line at a pitch of 5 μm, three or more adjacent perpendicular lines do not intersect with the remaining bonding interface.



[[Category:B23K20/02]]
[[Category:B23K20/24]]
[[Category:B23K103/12]]
[[Category:C22C9/00]]
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[[Category:CPC_B23K20/023]]