18981790. COPPER ALLOY JOINED BODY (NGK INSULATORS, LTD.)
COPPER ALLOY JOINED BODY
Organization Name
Inventor(s)
Masaaki Akaiwa of Chita-Gun JP
Takahiro Ishikawa of Toyoake-Shi JP
Kazuhiro Nomura of Handa-Shi JP
COPPER ALLOY JOINED BODY
This abstract first appeared for US patent application 18981790 titled 'COPPER ALLOY JOINED BODY
Original Abstract Submitted
There is provided a copper alloy bonded body composed of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another, wherein a bonding interface between the members remains. In the bonded body, the content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and, in a laser microscope image of a section including the bonding interface, a ratio of a total length of a line segment corresponding to a discontinuous region relative to an entire length of a bonding interface line defined along the bonding interface and a position where the bonding interface was present is 3.5% or more. The discontinuous region is defined as a region where, when a plurality of perpendicular lines is drawn with respect to the bonding interface line at a pitch of 5 μm, three or more adjacent perpendicular lines do not intersect with the remaining bonding interface.