View source for 18981786. COPPER ALLOY BONDED BODY (NGK INSULATORS, LTD.)

=COPPER ALLOY BONDED BODY=


==Organization Name==

[[:Category:NGK INSULATORS, LTD.|NGK INSULATORS, LTD.]]


[[Category:NGK INSULATORS, LTD.]]

==Inventor(s)==

[[:Category:Masaaki Akaiwa of Chita-Gun JP|Masaaki Akaiwa of Chita-Gun JP]][[Category:Masaaki Akaiwa of Chita-Gun JP]]

[[:Category:Takahiro Ishikawa of Toyoake-City JP|Takahiro Ishikawa of Toyoake-City JP]][[Category:Takahiro Ishikawa of Toyoake-City JP]]

[[:Category:Kazuhiro Nomura of Handa-City JP|Kazuhiro Nomura of Handa-City JP]][[Category:Kazuhiro Nomura of Handa-City JP]]

==COPPER ALLOY BONDED BODY==


This abstract first appeared for US patent application 18981786 titled 'COPPER ALLOY BONDED BODY

==Original Abstract Submitted==

There is provided a copper alloy bonded body composed of members made of an age-hardenable copper alloy, diffusion-bonded to one another. In the bonded body, a bonding interface between the members remains, and (i) the age-hardenable copper alloy is a beryllium copper alloy of which the beryllium content is 0.7% by weight or less, and an area ratio of inclusions composed of an oxide, a carbide, and/or an intermetallic compound in a HAADF-STEM image of a rectangular section of a size of 800 nm×400 nm including the bonding interface is 7.5% or less, or (ii) the age-hardenable copper alloy is a copper alloy free from beryllium, and an area ratio of inclusions composed of an oxide, a carbide, and/or an intermetallic compound in a HAADF-STEM image of a rectangular section of a size of 800 nm×400 nm including the bonding interface is 30% or less.



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[[Category:B23K103/12]]
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[[Category:CPC_B23K20/023]]