COPPER ALLOY BONDED BODY

Organization Name

NGK INSULATORS, LTD.

Inventor(s)

Masaaki Akaiwa of Chita-Gun JP

Takahiro Ishikawa of Toyoake-City JP

Kazuhiro Nomura of Handa-City JP

COPPER ALLOY BONDED BODY

This abstract first appeared for US patent application 18981786 titled 'COPPER ALLOY BONDED BODY

Original Abstract Submitted

There is provided a copper alloy bonded body composed of members made of an age-hardenable copper alloy, diffusion-bonded to one another. In the bonded body, a bonding interface between the members remains, and (i) the age-hardenable copper alloy is a beryllium copper alloy of which the beryllium content is 0.7% by weight or less, and an area ratio of inclusions composed of an oxide, a carbide, and/or an intermetallic compound in a HAADF-STEM image of a rectangular section of a size of 800 nm×400 nm including the bonding interface is 7.5% or less, or (ii) the age-hardenable copper alloy is a copper alloy free from beryllium, and an area ratio of inclusions composed of an oxide, a carbide, and/or an intermetallic compound in a HAADF-STEM image of a rectangular section of a size of 800 nm×400 nm including the bonding interface is 30% or less.