View source for 18961031. LOW COST PACKAGE WARPAGE SOLUTION (Intel Corporation)

=LOW COST PACKAGE WARPAGE SOLUTION=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Omkar G. Karhade of Chandler AZ US|Omkar G. Karhade of Chandler AZ US]][[Category:Omkar G. Karhade of Chandler AZ US]]

[[:Category:Nitin A. Deshpande of Chandler AZ US|Nitin A. Deshpande of Chandler AZ US]][[Category:Nitin A. Deshpande of Chandler AZ US]]

[[:Category:Debendra Mallik of Chandler AZ US|Debendra Mallik of Chandler AZ US]][[Category:Debendra Mallik of Chandler AZ US]]

[[:Category:Bassam M. Ziadeh of Gilbert AZ US|Bassam M. Ziadeh of Gilbert AZ US]][[Category:Bassam M. Ziadeh of Gilbert AZ US]]

[[:Category:Yoshihiro Tomita of Tsukuba-shi JP|Yoshihiro Tomita of Tsukuba-shi JP]][[Category:Yoshihiro Tomita of Tsukuba-shi JP]]

==LOW COST PACKAGE WARPAGE SOLUTION==


This abstract first appeared for US patent application 18961031 titled 'LOW COST PACKAGE WARPAGE SOLUTION

==Original Abstract Submitted==

Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.



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[[Category:H01L23/16]]
[[Category:H01L25/00]]
[[Category:H01L25/065]]
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[[Category:CPC_H01L21/563]]