View source for 18911171. Substrate Processing Apparatus (TOKYO ELECTRON LIMITED)

=Substrate Processing Apparatus=


==Organization Name==

[[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]


[[Category:TOKYO ELECTRON LIMITED]]

==Inventor(s)==

[[:Category:Naoki Kubota of Tokyo JP|Naoki Kubota of Tokyo JP]][[Category:Naoki Kubota of Tokyo JP]]

[[:Category:Hiroshi Sone of Tokyo JP|Hiroshi Sone of Tokyo JP]][[Category:Hiroshi Sone of Tokyo JP]]

==Substrate Processing Apparatus==


This abstract first appeared for US patent application 18911171 titled 'Substrate Processing Apparatus

==Original Abstract Submitted==

A substrate processing apparatus comprises a processing chamber having a ceiling and a cathode part installed at the ceiling and configured to sputter a target. The ceiling has an engagement portion around the target. The cathode part includes a first shield member having an attachment portion to be attached to the engagement portion and a conductive seal member configured to electrically connect the ceiling and the first shield member.



[[Category:H01J37/34]]
[[Category:C23C14/35]]
[[Category:C23C14/54]]
[[Category:H01J37/32]]
[[Category:CPC_H01J37/3441]]