View source for 18813593. SEMICONDUCTOR PACKAGE (ROHM CO., LTD.)

=SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:ROHM CO., LTD.|ROHM CO., LTD.]]


[[Category:ROHM CO., LTD.]]

==Inventor(s)==

[[:Category:Akira Sagawa of Kyoto (JP)|Akira Sagawa of Kyoto (JP)]][[Category:Akira Sagawa of Kyoto (JP)]]

==SEMICONDUCTOR PACKAGE==


This abstract first appeared for US patent application 18813593 titled 'SEMICONDUCTOR PACKAGE

==Original Abstract Submitted==

Provided is a semiconductor package including a Si substrate, a drift layer, a buffer layer, an anode electrode, a trench, a semiconductor apparatus, an anode terminal, a cathode terminal, and a sealing resin.



[[Category:H01L29/872]]
[[Category:H01L23/00]]
[[Category:H01L29/20]]
[[Category:H01L29/24]]
[[Category:H01L29/417]]
[[Category:H01L29/47]]
[[Category:H01L29/868]]
[[Category:CPC_H01L29/872]]