View source for 18809460. CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE (Infineon Technologies AG)

=CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE=


==Organization Name==

[[:Category:Infineon Technologies AG|Infineon Technologies AG]]


[[Category:Infineon Technologies AG]]

==Inventor(s)==

[[:Category:Carsten Joachim Von Koblinski of Villach AT|Carsten Joachim Von Koblinski of Villach AT]][[Category:Carsten Joachim Von Koblinski of Villach AT]]

[[:Category:Tobias Polster of Finkenstein AT|Tobias Polster of Finkenstein AT]][[Category:Tobias Polster of Finkenstein AT]]

==CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE==


This abstract first appeared for US patent application 18809460 titled 'CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE

==Original Abstract Submitted==

A semiconductor device includes a semiconductor chip having a front side and a backside. A first electrode is disposed on the front side of the semiconductor chip. An inorganic substrate includes a first side, a second side opposite the first side, and a first lateral side extending between the first side and the second side. A metal layer is disposed over the first side and the first lateral side of the inorganic substrate. The first electrode is bonded to the metal layer.



[[Category:H01L23/498]]
[[Category:H01L21/48]]
[[Category:H01L23/00]]
[[Category:H01L23/13]]
[[Category:H01L23/15]]
[[Category:CPC_H01L23/49838]]