18809460. CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE (Infineon Technologies AG)
CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Carsten Joachim Von Koblinski of Villach AT
Tobias Polster of Finkenstein AT
CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 18809460 titled 'CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
Original Abstract Submitted
A semiconductor device includes a semiconductor chip having a front side and a backside. A first electrode is disposed on the front side of the semiconductor chip. An inorganic substrate includes a first side, a second side opposite the first side, and a first lateral side extending between the first side and the second side. A metal layer is disposed over the first side and the first lateral side of the inorganic substrate. The first electrode is bonded to the metal layer.