View source for 18805678. COMPONENT-ATTACHED FPC MANUFACTURING METHOD (Yazaki Corporation)

=COMPONENT-ATTACHED FPC MANUFACTURING METHOD=


==Organization Name==

[[:Category:Yazaki Corporation|Yazaki Corporation]]


[[Category:Yazaki Corporation]]

==Inventor(s)==

[[:Category:Hidehiko Shimizu of Makinohara-shi (JP)|Hidehiko Shimizu of Makinohara-shi (JP)]][[Category:Hidehiko Shimizu of Makinohara-shi (JP)]]

==COMPONENT-ATTACHED FPC MANUFACTURING METHOD==


This abstract first appeared for US patent application 18805678 titled 'COMPONENT-ATTACHED FPC MANUFACTURING METHOD

==Original Abstract Submitted==

A component-attached FPC manufacturing method for manufacturing a component-attached FPC in which a circuit component is solder-bonded to an FPC, includes an FPC forming step of forming an FPC that integrally includes an FPC body, an FPC arm portion branching off from the FPC body, a component mounting portion provided on an end portion of the FPC arm portion and on which the circuit component is mounted, and a bridge connecting the component mounting portion and the FPC body, a component mounting step of mounting the circuit component on the component mounting portion via a solder, and an implementing step of heating the FPC, melting the solder, and implementing the circuit component on the component mounting portion.



[[Category:H05K3/34]]
[[Category:B23K1/00]]
[[Category:B23K101/42]]
[[Category:H05K1/18]]
[[Category:CPC_H05K3/341]]