View source for 18804501. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)

=SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Youngbae Kim of Suwon-si (KR)|Youngbae Kim of Suwon-si (KR)]][[Category:Youngbae Kim of Suwon-si (KR)]]

==SEMICONDUCTOR PACKAGE==


This abstract first appeared for US patent application 18804501 titled 'SEMICONDUCTOR PACKAGE

==Original Abstract Submitted==

A semiconductor package includes a package substrate that extends in a first direction, an interposer on an upper surface of the package substrate, where the interposer includes: a first substrate that includes a first portion having a first thickness in a second direction that is perpendicular to the first direction and a second portion having a second thickness in the second direction that is greater than the first thickness, and a plurality of first through vias that extend into the first substrate, a photonic IC chip on the first portion of the first substrate, where the photonic IC chip includes: a second substrate, a front insulation layer, an optical waveguide, an optical fiber, and a coupler, and a plurality of semiconductor chips on the second portion of the interposer.



[[Category:H01L23/13]]
[[Category:G02B6/42]]
[[Category:H01L23/00]]
[[Category:H01L23/498]]
[[Category:H01L25/16]]
[[Category:H10B80/00]]
[[Category:CPC_H01L23/13]]