View source for 18781000. MULTILAYER ELECTRONIC COMPONENT (Samsung Electro-Mechanics Co., Ltd.)

=MULTILAYER ELECTRONIC COMPONENT=


==Organization Name==

[[:Category:Samsung Electro-Mechanics Co., Ltd.|Samsung Electro-Mechanics Co., Ltd.]]


[[Category:Samsung Electro-Mechanics Co., Ltd.]]

==Inventor(s)==

[[:Category:Jong Hoon Yoo of Suwon-si KR|Jong Hoon Yoo of Suwon-si KR]][[Category:Jong Hoon Yoo of Suwon-si KR]]

[[:Category:Ji Hyun Lee of Suwon-si KR|Ji Hyun Lee of Suwon-si KR]][[Category:Ji Hyun Lee of Suwon-si KR]]

[[:Category:Dong Geon Yoo of Suwon-si KR|Dong Geon Yoo of Suwon-si KR]][[Category:Dong Geon Yoo of Suwon-si KR]]

[[:Category:Eun Hye Cho of Suwon-si KR|Eun Hye Cho of Suwon-si KR]][[Category:Eun Hye Cho of Suwon-si KR]]

==MULTILAYER ELECTRONIC COMPONENT==


This abstract first appeared for US patent application 18781000 titled 'MULTILAYER ELECTRONIC COMPONENT

==Original Abstract Submitted==

A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer, wherein the electrode layer includes a connection electrode layer including copper (Cu) and glass, and a band electrode layer including silver (Ag) and glass, and the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a conductive metal and a resin.



[[Category:H01G4/232]]
[[Category:H01G4/008]]
[[Category:H01G4/12]]
[[Category:H01G4/30]]
[[Category:CPC_H01G4/2325]]