View source for 18732570. POLISHING APPARATUS AND POLISHING METHOD (EBARA CORPORATION)

=POLISHING APPARATUS AND POLISHING METHOD=


==Organization Name==

[[:Category:EBARA CORPORATION|EBARA CORPORATION]]


[[Category:EBARA CORPORATION]]

==Inventor(s)==

[[:Category:SAURABH Kulkarni of Tokyo (JP)|SAURABH Kulkarni of Tokyo (JP)]][[Category:SAURABH Kulkarni of Tokyo (JP)]]

==POLISHING APPARATUS AND POLISHING METHOD==


This abstract first appeared for US patent application 18732570 titled 'POLISHING APPARATUS AND POLISHING METHOD




==Original Abstract Submitted==

The disclosure provides a polishing apparatus capable of removing a polishing liquid or polishing debris from a light passing portion of a polishing pad. A polishing apparatus  includes a polishing table  supporting a polishing pad  that has a light passing portion ; a polishing head  pressing a substrate W against a polishing surface of the polishing pad ; an optical sensor  disposed in the polishing table , irradiating light to the substrate W through the light passing portion , and receiving reflected light from the substrate W through the light passing portion ; and a cleaning portion  forming a cleaning space CS that covers the light passing portion  above the light passing portion  and supplying a cleaning fluid to the light passing portion  through the cleaning space CS.



[[Category:B24B49/12]]
[[Category:B08B3/02]]
[[Category:B08B7/02]]
[[Category:B24D7/12]]
[[Category:CPC_B24B49/12]]