View source for 18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

=Chamfered Die of Semiconductor Package and Method for Forming the Same=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Chen-Hua Yu of Hsinchu (TW)|Chen-Hua Yu of Hsinchu (TW)]][[Category:Chen-Hua Yu of Hsinchu (TW)]]

[[:Category:Wei-Kang Hsieh of Tainan City (TW)|Wei-Kang Hsieh of Tainan City (TW)]][[Category:Wei-Kang Hsieh of Tainan City (TW)]]

[[:Category:Shih-Wei Chen of Hsinchu (TW)|Shih-Wei Chen of Hsinchu (TW)]][[Category:Shih-Wei Chen of Hsinchu (TW)]]

[[:Category:Tin-Hao Kuo of Hsinchu (TW)|Tin-Hao Kuo of Hsinchu (TW)]][[Category:Tin-Hao Kuo of Hsinchu (TW)]]

[[:Category:Hao-Yi Tsai of Hsinchu (TW)|Hao-Yi Tsai of Hsinchu (TW)]][[Category:Hao-Yi Tsai of Hsinchu (TW)]]

==Chamfered Die of Semiconductor Package and Method for Forming the Same - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18514126 titled 'Chamfered Die of Semiconductor Package and Method for Forming the Same

==Simplified Explanation==

The semiconductor device described in the patent application includes a die with a chamfered corner, an encapsulant covering the front-side surface of the die, a redistribution structure on the encapsulant, a thermal module attached to the back-side surface of the die, and a bolt passing through the redistribution structure and the thermal module.

* Die with chamfered corner
* Encapsulant over front-side surface of die
* Redistribution structure on encapsulant
* Thermal module on back-side surface of die
* Bolt extending through redistribution structure and thermal module

== Potential Applications ==
* Electronics manufacturing
* Semiconductor industry
* Thermal management systems

== Problems Solved ==
* Improved heat dissipation
* Enhanced structural integrity
* Secure attachment of components

== Benefits ==
* Increased reliability
* Better performance
* Simplified assembly process


==Original Abstract Submitted==

A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.



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