18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Chamfered Die of Semiconductor Package and Method for Forming the Same
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wei-Kang Hsieh of Tainan City (TW)
Chamfered Die of Semiconductor Package and Method for Forming the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 18514126 titled 'Chamfered Die of Semiconductor Package and Method for Forming the Same
Simplified Explanation
The semiconductor device described in the patent application includes a die with a chamfered corner, an encapsulant covering the front-side surface of the die, a redistribution structure on the encapsulant, a thermal module attached to the back-side surface of the die, and a bolt passing through the redistribution structure and the thermal module.
- Die with chamfered corner
- Encapsulant over front-side surface of die
- Redistribution structure on encapsulant
- Thermal module on back-side surface of die
- Bolt extending through redistribution structure and thermal module
Potential Applications
- Electronics manufacturing
- Semiconductor industry
- Thermal management systems
Problems Solved
- Improved heat dissipation
- Enhanced structural integrity
- Secure attachment of components
Benefits
- Increased reliability
- Better performance
- Simplified assembly process
Original Abstract Submitted
A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.
